Zhenzhen Peng

Ms. Zhenzhen Peng

Beijing, The School of Electronic and Information Engineering,Beihang University, Beijing, China

Research Focus & Metrics

Academic Career Length

8Years (2019-Present)

(Calculated once Scilit publication data is synced: current year − year of first publication + 1)

Representative Publications

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1 September 2019 in Chinese Journal of Electronics
Verified
Journal Article
Open access
PDF file
DSDonglin Su
Donglin Su
KZKaixiang Zhu
Kaixiang Zhu
HXHui Xu
Hui Xu
ZPZhenzhen Peng
Zhenzhen Peng
SYShunchuan Yang
Shunchuan Yang
YLYan Liu
Yan Liu
Accurate parasitic parameter extraction of high-frequency transformers is one of the key techniques to efficiently design a Switched-mode power supply(SMPS). An approach to accurately and efficiently extract the parasitic parameters of high-frequency transformers is proposed. The high-frequency transformer is first decomposed into first-order RL and second-order RLC circuits according to inherent step response characteristics. Through the measured discharging pulse and damped oscillation responses of the high-frequency transformer excited by a square wave, we can extract the equivalent circuit parameters through fitting the responses with Particle swarm optimization(PSO). The equivalent circuits of the high-frequency transformer with the desired parameters are obtained for the SMPS design. We validate the effectiveness and accuracy of the proposed method with simulations and measurements.

1 March 2021 in Chinese Journal of Electronics
Verified
Journal Article
Open access
PDF file
ZPZhenzhen Peng
Zhenzhen Peng
DSDonglin Su
Donglin Su
Analytical models for passive linear structures, like metallic traces, vias, are proposed for simulations at the package and Printed circuit board (PCB) levels. In the proposed method, traces are modeled based on the transmission line theory, whereas the vias are described by the parallel‐plate impedance and several equivalent circuits elements. The proposed models can be applied to efficiently simulate composed passive linear structures. Several scenarios are analyzed including traces with two or three width, traces routed into different layers and interconnects commonly used in PCBs. The results of the models are compared with those from the full‐wave simulations and experiments. An improvement on the computation speed has been observed with respect to the full‐wave simulations at the effective range of models. In our measurements, a compensation approach of impedance mismatch in parameter measurements is analyzed and calculated, which could significantly simplify the experimental process.