Fei Liu

Dr. Fei Liu

Materials Science & Engineering, Iowa State University, Ames, IA 50011, USA

Research Focus & Metrics

Academic Career Length

9Years (2018-Present)

(Calculated once Scilit publication data is synced: current year − year of first publication + 1)

Representative Publications

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31 January 2018 in Science China Materials
Verified
Journal Article
Closed access
PDF file
JYJing Yu
Jing Yu
WGWeiliang Gao
Weiliang Gao
Fei LiuFei Liu
Fei Liu
YJYanmin Ju
Yanmin Ju
FZFan Zhao
Fan Zhao
YHYanglong Hou
Yanglong Hou

21 November 2025 in Journal of Colloid and Interface Science
Verified
Journal Article
Closed access
Fei LiuFei Liu
Fei Liu
YLYu Hui Lui
Yu Hui Lui
SSSimin Sun
Simin Sun
WHWenyu Huang
Wenyu Huang
Shan HuShan Hu
Shan Hu
SJShan Jiang
Shan Jiang

13 November 2020
Verified
Conference Paper
Open access
Yifan LiYifan Li
Yifan Li
Fei LiuFei Liu
Fei Liu
EOEmily Olson
Emily Olson
SJShan Jiang
Shan Jiang
Recent progress in developing functional coating materials based on novel binder morphology, self-assembly and nanotechnology will be discussed. Different from most of the conventional waterborne coating materials, which consist of spherical binder particles, anisotropic non-spherical binder particles have been investigated in this presentation. Polymeric amphiphilic Janus

3 April 2026 in Biosensors
Verified
Journal Article
Open access
PDF file
ABAbhijit Bera
Abhijit Bera
Fei LiuFei Liu
Fei Liu
MMMatthew R. Marander
Matthew R. Marander
RORicardo Ortega
Ricardo Ortega
AMAhmad M. Malkawi
Ahmad M. Malkawi
SJShan Jiang
Shan Jiang
Printed electronics have emerged as a versatile manufacturing platform for next-generation biosensors, enabling on-demand and low-cost fabrication of functional devices on flexible, stretchable, and unconventional substrates. One major challenge in this field lies in the sintering of printed features, as conventional high-temperature processing is incompatible with polymeric substrates and thermally sensitive biological components. Low-temperature sintering inks, typically processed below 200 °C or even at room temperature, have become a critical enabling technology for bio-integrated electronics. This review provides an overview of the current state-of-the-art and key challenges associated with low-temperature sintering inks for printed bioelectronics. We discuss inks based on metal nanoparticles, metal–organic decomposition precursors, metal oxides, chalcogenides, and hybrid material systems. The emphasis is on how ink chemistry, ligand selection, and precursor structure govern rheology, stability, and sintering behavior. In addition, key low-temperature sintering and curing strategies, including thermal, photonic, laser, plasma, microwave, and chemical sintering, are compared in terms of energy delivery, densification mechanisms, and substrate compatibility. Finally, we outline emerging directions towards low temperature and room-temperature sintering inks, and sustainable biobased ink formulations, and discuss their applications for wearable, implantable, and soft biosensing platforms.