A kind of devices Pt/Ag/ZnO:Li/Pt/Ti with high resistive switching behaviors were prepared on a SiO₂/Si substrate by using magnetron sputtering method and mask technology, composed of a bottom electrode (BE) of Pt/Ti, a resistive switching layer of ZnO:Li thin film and a top electrode (TE) of Pt/Ag. To determine the crystal lattice structure and the Li-doped concentration in the resulted ZnO thin films, X-ray diffraction (XRD) and X-ray photoelectron spectroscopy (XPS) tests were carried out. Resistive switching behaviors of the devices with different thicknesses of Li-doped ZnO thin films were studied at different set and reset voltages based on analog and digital resistive switching characteristics. At room temperature, the fabricated devices represent stable bipolar resistive switching behaviors with a low set voltage, a high switching current ratio and a long retention up to 10⁴ s. In addition, the device can sustain an excellent endurance more than 10³ cycles at an applied pulse voltage. The mechanism on how the thicknesses of the Li-doped ZnO thin films affect the resistive switching behaviors was investigated by installing conduction mechanism models. This study provides a new strategy for fabricating the resistive random access memory (ReRAM) device used in practice.

A monolithic-integrated 3-D magnetic field sensor is proposed in this paper, which is composed of four silicon magnetic sensitive transistors and a Hall magnetic field sensor. Using microelectromechanical system (MEMS) technology, the chip of the sensor was designed and fabricated on a p-type silicon wafer with a higher resistivity. At the room temperature, the magnetic sensitivities S _xx and S _yy on the x- and y-directions are 77.5 and 78.6 mV/T at power supply V _DD = 5.0 V and base injection current I _b = 1.0 mA, respectively. In addition, the magnetic sensitivity S _zz on the z-axis is 77.4 mV/T at V _DD = 5.0 V. The experimental results show that the proposed sensor has a good uniformity of magnetic sensitivity, besides achieving the measurement to 3-D magnetic fields and the cross sensitivities are less than 3% at B ≤ 0.8 T.

A three-axis accelerometer with a double L-shaped beams structure was designed and fabricated in this paper, consisting of a supporting body, four double L-shaped beams and intermediate double beams connected to two mass blocks. When applying acceleration to the accelerometer chip, according to the output voltage changes of three Wheatstone bridges constituted by twelve piezoresistors on the roots of the beams, the corresponding acceleration along three axes can be measured based on the elastic force theory and piezoresistive effect. To improve the characteristics of the three-axis accelerometer, we simulated how the width of the intermediate double beams affected the characteristics. Through optimizing the structure size, six chips with different widths of intermediate double beams were fabricated on silicon-on-insulator (SOI) wafers using micro-electromechanical systems (MEMS) technology and were packaged on printed circuit boards (PCB) by using an electrostatic bonding process and inner lead bonding technology. At room temperature and V_DD = 5.0 V, the resulting accelerometer with an optimized size (w = 500 μm) realized sensitivities of 0.302 mV/g, 0.235 mV/g and 0.347 mV/g along three axes, with a low cross-axis sensitivity. This result provides a new strategy to further improve the characteristics of the three-axis accelerometer.

In order to improve the output sensitivity of the piezoelectric acceleration sensor, this paper proposed a high sensitivity acceleration sensor based on a piezoelectric metal oxide semiconductor field effect transistor (MOSFET). It is constituted by a piezoelectric beam and an N-channel depletion MOSFET. A silicon cantilever beam with Pt/ZnO/Pt/Ti multilayer structure is used as a piezoelectric beam. Based on the piezoelectric effect, the piezoelectric beam generates charges when it is subjected to acceleration. Due to the large input impedance of the MOSFET, the charge generated by the piezoelectric beam can be used as a gate control signal to achieve the purpose of converting the output charge of the piezoelectric beam into current. The test results show that when the external excitation acceleration increases from 0.2 g to 1.5 g with an increment of 0.1 g, the peak-to-peak value of the output voltage of the proposed sensors increases from 0.327 V to 2.774 V at a frequency of 1075 Hz. The voltage sensitivity of the piezoelectric beam is 0.85 V/g and that of the proposed acceleration sensor was 2.05 V/g, which is 2.41 times higher than the piezoelectric beam. The proposed sensor can effectively improve the voltage output sensitivity and can be used in the field of structural health monitoring.

In this study, a Pt/Ag/LZO/Pt resistive random access memory (RRAM), doped by different Li-doping concentrations was designed and fabricated by using a magnetron sputtering method. To determine how the Li-doping concentration affects the crystal lattice structure in the composite ZnO thin films, X-ray diffraction (XRD) and X-ray photoelectron spectroscopy (XPS) tests were carried out. The resistive switching behaviors of the resulting Pt/Ag/LZO/Pt devices, with different Li-doping contents, were studied under direct current (DC) and pulse voltages. The experimental results showed that compared with the devices doped with Li-8% and -10%, the ZnO based RRAM device doped by 5% Li-doping presented stable bipolar resistive switching behaviors with DC voltage, including a low switching voltage (10³ cycles), long retention time (>10⁴ s), and a large resistive switching window. In addition, quick switching between a high-resistance state (HRS) and a low-resistance state (LRS) was achieved at a pulse voltage. To investigate the resistive switching mechanism of the device, a conduction model was installed based on Ag conducting filament transmission. The study of the resulting Pt/Ag/LZO/Pt devices makes it possible to further improve the performance of RRAM devices.

A two-dimensional (2D) magnetic field sensor consisting of four silicon magnetic sensitive transistors (SMSTs) with similar characteristics is presented in this paper. By use of micro-electromechanical systems (MEMS) and integrated packaging technology, this sensor fabricated by using the silicon wafer with a orientation and high resistivity, was packaged on printed circuit boards (PCBs). In order to detect the magnetic fields in the x and y axes directions, two of the four SMSTs with opposite magnetic sensitive directions were located along the x and −x axes directions, symmetrically, and the others were located along the y and −y axes directions. The experimental results show that when the V_CE = 10.0 V and I_B = 6.0 mA, the magnetic sensitivities of the sensor in the x and y axes directions are 366.0 mV/T and 365.0 mV/T, respectively. It is possible to measure the 2D magnetic field and improve the magnetic sensitivity, significantly.