A cool way to use isotopes: Thermal management of electronics requires materials that can efficiently remove heat. Several promising materials have been found recently, but diamond remains the bulk material with the highest thermal conductivity. Chen et al. found that isotopically pure cubic boron nitride has an ultrahigh thermal conductivity, 75% that of diamond. Using only boron-11 or boron-10 allows the crystal vibrations that carry heat to move more efficiently through the material. This property could be exploited for better regulating the temperature of high-power devices. Science , this issue p. 555

Discovery of thermoelectric materials has long been realized by the Edisonian trial and error approach. However, recent progress in theoretical calculations, including the ability to predict structures of unknown phases along with their thermodynamic stability and functional properties, has enabled the so-called inverse design approach. Compared to the traditional materials discovery, the inverse design approach has the potential to substantially reduce the experimental efforts needed to identify promising compounds with target functionalities. By adopting this approach, here we have discovered several unreported half-Heusler compounds. Among them, the p-type TaFeSb-based half-Heusler demonstrates a record high ZT of ~1.52 at 973 K. Additionally, an ultrahigh average ZT of ~0.93 between 300 and 973 K is achieved. Such an extraordinary thermoelectric performance is further verified by the heat-to-electricity conversion efficiency measurement and a high efficiency of ~11.4% is obtained. Our work demonstrates that the TaFeSb-based half-Heuslers are highly promising for thermoelectric power generation.

Thermoelectric properties are heavily dependent on the carrier concentration, and therefore the optimization of carrier concentration plays a central role in achieving high thermoelectric performance. The optimized carrier concentration is highly temperature-dependent and could even possibly vary within one order of magnitude in the temperature range of several hundreds of Kelvin. Practically, however, the traditional doping strategy will only lead to a constant carrier concentration, and thus the thermoelectric performance is only optimized within a limited temperature range. Here, we demonstrate that a temperature-dependent carrier concentration can be realized by simultaneously introducing shallow and deep defect levels. In this work, iodine (I) and indium (In) are co-doped in PbTe, where iodine acts as the shallow donor level that supplies sufficient electrons and indium builds up the localized half-filled deep defect state in the band gap. The indium deep defect state traps electrons at a lower temperature and the trapped electrons will be thermally activated back to the conduction band when the temperature rises. In this way, the carrier concentration can be engineered as temperature-dependent, which matches the theoretically predicted optimized carrier concentration over the whole temperature range. As a result, a room temperature ZT of ∼0.4 and a peak ZT of ∼1.4 at 773 K were obtained in the n-type In/I co-doped PbTe, leading to a record-high average ZT of ∼1.04 in the temperature range of 300 to 773 K. Importantly, since deep defect levels also exist in other materials, the strategy of deep defect level engineering should be widely applicable to a variety of materials for enhancing the thermoelectric performance across a broad temperature range.

Modern society relies on high charge mobility for efficient energy production and fast information technologies. The power factor of a material—the combination of electrical conductivity and Seebeck coefficient—measures its ability to extract electrical power from temperature differences. Recent advancements in thermoelectric materials have achieved enhanced Seebeck coefficient by manipulating the electronic band structure. However, this approach generally applies at relatively low conductivities, preventing the realization of exceptionally high-power factors. In contrast, half-Heusler semiconductors have been shown to break through that barrier in a way that could not be explained. Here, we show that symmetry-protected orbital interactions can steer electron–acoustic phonon interactions towards high mobility. This high-mobility regime enables large power factors in half-Heuslers, well above the maximum measured values. We anticipate that our understanding will spark new routes to search for better thermoelectric materials, and to discover high electron mobility semiconductors for electronic and photonic applications.

Spatially resolved vibrational mapping of nanostructures is indispensable to the development and understanding of thermal nanodevices¹, modulation of thermal transport² and novel nanostructured thermoelectric materials^3–5. Through the engineering of complex structures, such as alloys, nanostructures and superlattice interfaces, one can significantly alter the propagation of phonons and suppress material thermal conductivity while maintaining electrical conductivity². There have been no correlative experiments that spatially track the modulation of phonon properties in and around nanostructures due to spatial resolution limitations of conventional optical phonon detection techniques. Here we demonstrate two-dimensional spatial mapping of phonons in a single silicon–germanium (SiGe) quantum dot (QD) using monochromated electron energy loss spectroscopy in the transmission electron microscope. Tracking the variation of the Si optical mode in and around the QD, we observe the nanoscale modification of the composition-induced red shift. We observe non-equilibrium phonons that only exist near the interface and, furthermore, develop a novel technique to differentially map phonon momenta, providing direct evidence that the interplay between diffuse and specular reflection largely depends on the detailed atomistic structure: a major advancement in the field. Our work unveils the non-equilibrium phonon dynamics at nanoscale interfaces and can be used to study actual nanodevices and aid in the understanding of heat dissipation near nanoscale hotspots, which is crucial for future high-performance nanoelectronics.