To improve polishing performance and reduce the environmental pollution of chemical mechanical polishing (CMP) tests, mesoporous shell/core silica abrasives were prepared, and a novel green CMP slurry was developed, including sorbitol, hydrogen peroxide and sodium carbonate. Prior to CMP, fused silica was roughly polished with ceria slurry. Using developed mesoporous abrasives, surface roughness S_a is reduced from 0.347 to 0.253 nm for a scanning area of 200 × 200 μm², and the material removal rate (MRR) is increased from 70 to 127 nm min⁻¹, compared with traditional solid abrasives. Based on molecular dynamics (MD) simulations, a novel atomic removal model is proposed for mesoporous abrasives through the immediate elastic recovery of atoms. MD simulations suggest that the formation of convex peaks and pits was inhibited by the mesoporous structure, promoting uniform distribution of surface atoms and atomic removal. This is different from a conventional simple increase of polishing times. In addition, more bridge bonds of Si–O–Si and a lower average Si–O bond order are produced in fused silica samples due to their mesoporous structure, contributing to a higher MRR.

Quartz glass shows superior physicochemical properties and is used in modern high technology. Due to its hard and brittle characteristics, traditional polishing slurry mostly uses strong acid, strong alkali, and potent corrosive additives, which cause environmental pollution. Furthermore, the degree of damage reduces service performance of the parts due to the excessive corrosion. Therefore, a novel quartz glass green and efficient non-damaging chemical mechanical polishing slurry was developed, consisting of cerium oxide (CeO₂), Lanthanum oxyfluoride (LaOF), potassium pyrophosphate (K₄P₂O₇), sodium N-lauroyl sarcosinate (SNLS), and sodium polyacrylate (PAAS). Among them, LaOF abrasive showed hexahedral morphology, which increased the cutting sites and uniformed the load. The polishing slurry was maintained by two anionic dispersants, namely SNLS and PAAS, to maintain the suspension stability of the slurry, which makes the abrasive in the slurry have a more uniform particle size and a smoother sample surface after polishing. After the orthogonal test, a surface roughness (S_a) of 0.23 nm was obtained in the range of 50 × 50 μm², which was lower than the current industry rating of 0.9 nm, and obtained a material removal rate (MRR) of 530.52 nm/min.

Diamond wire sawing is widely used in processing NdFeB rare earth permanent magnets. However, it induces periodic saw marks and fracture chipping pits, which severely affect the flatness and surface quality of the products. In this study, the lateral motion of the diamond wire was monitored to determine the surface formation mechanism. Then, a white light interferometer and an SEM were used to observe the sawed surface profile. Finally, the surface quality was quantitatively studied by identifying the area rate of fracture chipping pits with an image recognition MATLAB script. According to the observation results, the calculation formula of PV which is related to the process parameters was deduced. Additionally, by combining the fracture rate and wire vibration, a novel method was proposed to investigate the optimal process parameters. It can be found that the surface quality sawed at P = 0.21 MPa, v_f = 0.2 mm/min, and v_s = 1.8 m/s remains better than when sawed at P = 0.15 MPa, v_f = 0.1 mm/min, and v_s = 1.8 m/s, which means the sawing efficiency can be doubled under such circumstances, i.e., when the surface quality remains the same.

The normal processing of sintered NdFeB magnets, used in many applied fields, involves diamond wire sawing. Due to the fact of its relatively lower hardness and high brittleness, the surface roughness and periodic waviness of the sawed surface have become a serious problem, but the surface formation mechanism is still unknown. In this work, a diamond wire sawing experiment with a NdFeB magnet was conducted while both the cutting force and the diamond wire lateral displacement were monitored. The vibration, the lateral swing of the wire and the cutting force were thoroughly analyzed. After the experiment, the surface morphology was carefully inspected under both a white light interferometer and SEM. It was discovered that the lateral swing of the diamond wire was the main cause of the periodic waviness on the surface, the PV of which was positively proportional to the normal cutting force. The surface morphology and surface roughness along the saw mark revealed that the vibration impact of ploughing/rubbing grits can induce the NdFeB grain to loosen off and cause more brittle fractures when the feed rate was 0.05 mm/min under wet cutting.

AlSi10Mg has a good forming ability and has been widely accepted as an optimal material for selective laser melting (SLM). However, the strength and elongation of unmodified AlSi10Mg are insufficient, which limits its application in the space industry. In this paper, yttrium oxide (Y₂O₃) nanoparticles modified AlSi10Mg composites that were manufactured using SLM. The effects of Y₂O₃ nanoparticles (0~2 wt.% addition) on the microstructure and mechanical properties of AlSi10Mg alloys were investigated. An ultimate tensile strength of 500.3 MPa, a yield strength of 322.3 MPa, an elongation of 9.7%, a good friction coefficient of 0.43, and a wear rate of (3.40 ± 0.09) ×10⁻⁴ mm³·N⁻¹·m⁻¹ were obtained with the addition of 0.5 wt.% Y₂O₃ nanoparticles, and all these parameters were higher than those of the SLMed AlSi10Mg alloy. The microhardness of the composite with 1.0 wt.% Y₂O₃ reached 145.6 HV_0.1, which is an increase of approximately 22% compared to the unreinforced AlSi10Mg. The improvement of tensile properties can mainly be attributed to Orowan strengthening, fine grain strengthening, and load-bearing strengthening. The results show that adding an appropriate amount of Y₂O₃ nanoparticles can significantly improve the properties of the SLMed AlSi10Mg alloy.