We present the design, bench-top setup, and experimental results of a compact heterodyne interferometer that achieves picometer-level displacement sensitivities in air over frequencies above 100 MHz. The optical configuration with spatially separated beams prevents frequency and polarization mixing, and therefore eliminates periodic errors. The interferometer is designed to maximize common-mode optical laser beam paths to obtain high rejection of environmental disturbances, such as temperature fluctuations and acoustics. The results of our experiments demonstrate the short- and long-term stabilities of the system during stationary and dynamic measurements. In addition, we provide measurements that compare our interferometer prototype with a commercial system, verifying our higher sensitivity of 3 pm, higher thermal stability by a factor of two, and periodic-error-free performance.

In this investigation, we describe a combined low-coherence interferometric technique to measure the surface and thickness profiles of wafers at once with high speed. The measurement system consists of a spectrally resolved interferometer to provide and monitor the optical path difference between two incident beams of the optical source part and a low-coherence scanning interferometer to measure the dimensions of wafers with significantly shortened scanning length. In the experiments, a silicon wafer and a sapphire wafer, of which both sides are polished, were used as targets of the measurement system for verification of the proposed system. As a result, the scanning length of the low-coherence scanning interferometer was reduced from a few millimeters to a few hundreds of micrometers approximately 10 times. In addition, surface profiles of both sides and thickness profiles were simultaneously measured to reconstruct 3D shapes of wafers.

In this investigation, a low cost Si wafer metrology system based on low coherence interferometry using NIR light is proposed and verified. The whole system consists of two low coherence interferometric principles: low coherence scanning interferometry (LCSI) for measuring surface profiles and spectrally-resolved interferometry (SRI) to obtain the nominal optical thickness of the double-sided polished Si wafer. The combination of two techniques can reduce the measurement time and give adequate dimensional information of the Si wafer. The wavelength of the optical source is around 1 μm, for which transmission is non-zero for undoped silicon and can be also detected by a typical CCD camera. Because of the typical CCD camera, the whole system can be constructed inexpensively.

In this investigation, we propose an effective method to measure 3D surface profiles of specimens with single-shot imaging. Based on the two-wavelength interferometric principle and spatial phase-shifting technique using a polarization pixelated camera, the proposed system can not only rapidly measure the phase, but also overcome the 2π-ambiguity problem of typical phase-shifting interferometry. The rough surface profile can be calculated by the visibility of the interference fringe and can compensate for the height discontinuity by phase jumps occurring in a fine height map. An inclined plane mirror and a step height specimen with 9 μm were used for the validation of capability of measuring continuously smooth surface and large step heights. The measurement results were in good agreement with the results of typical two-wavelength interferometry.

Subaperture stitching wavelength scanning interferometry with a high-accuracy multi-axis position stage is proposed for measuring complex surface shapes such as aspherical and freeform optics. Typical optical approaches suffer due to poor fringe visibility when it comes to complex-shaped optics. Our proposed technique allows a proper solution to this challenging issue by keeping the optical probe perpendicular to the surface slope, which provides good fringe visibility during the wavelength scan regardless of how steep the surface is. Also, the full-aperture surface map of a test sample can be obtained by stitching multiple subaperture measurement results with high precision. We tested and verified our method by measuring several representative samples and comparing the measurement results with a well-established stylus method.