A new interatomic potential for the pure tin (Sn) system is developed on the basis of the second-nearest-neighbor modified embedded-atom-method formalism. The potential parameters were optimized based on the force-matching method utilizing the density functional theory (DFT) database of energies and forces of atomic configurations under various conditions. The developed potential significantly improves the reproducibility of many fundamental physical properties compared to previously reported modified embedded-atom method (MEAM) potentials, especially properties of the β phase that is stable at the ambient condition. Subsequent free energy calculations based on the quasiharmonic approximation and molecular-dynamics simulations verify that the developed potential can be successfully applied to study the allotropic phase transformation between α and β phases and diffusion phenomena of pure tin.

Highly uniform Cu micropillars were electrodeposited on a Cu seed layer in a micropatterned photoresist in the presence of binary levelers containing pyrrolidine and pyridine functional groups. The adsorption behaviors of binary levelers, i.e., 3-hydroxy-6-(tert-butyl)pyridine and pyridinium tribromide in an electroplating bath were investigated by chronopotentiometry with sequential injection of levelers and linear sweep voltammetry with a rotating disk electrode. From electrochemical analysis, pyridinium tribromide composed of a positively charged pyridine ring was strongly adsorbed on the Cu seed surface, relative to 3-hydroxy-6-(tert-butyl)pyridine. Additional microscopy, surface roughness, and nitrogen concentration analyses revealed that the binary levelers were preferentially adsorbed on the center and the edge region of the Cu seed, resulting in a uniform Cu pillar profile. The possible mechanism of highly uniform Cu pillar deposition was discussed in terms of the adsorption behaviors of the levelers dependent on their molecular structures.