AlGaN/GaN HEMTs with several different designs of field plate structure are studied for device optimization purposes. To increase device breakdown voltage, optimal dimensions of field plates were first investigated using Silvaco TCAD software, and the electrical characteristics of the devices are analyzed. Several devices were designed and fabricated based on the simulation results. It has been confirmed that the gate-source composite field plate (SG-FP) has a higher breakdown voltage than other types of field plate structures, with FOM reaches 504 MW/cm⁻², showing that the device with SG-FP structure outperforms the other three structures. The experiment and simulation verify that the gate-source composite field plate optimizes FOM by increasing the breakdown voltage and reducing the intrinsic on-resistance so that the device has better electrical performance and a wider application range.

The material quality of III-nitrides is severely limited by the lack of cost-effective substrates with suitable lattice and thermal expansion coefficients. A suspended ultrathin silicon membrane substrate ( $$\sim$$∼ 16 nm), fabricated by an easy process on SOI substrates, is thus designed for nitride epitaxial growth, which can effectively release the strain in the epi-layers, and has demonstrated large-area (Al)GaN growth with a smooth surface and greatly reduced defect density. This research provides a promising CMOS-compatible method for growing cost-effectively high-quality III-nitrides that can be used for the development of high-performance devices.