Ming Feng received his Ph.D degree in machining from Akita Prefectural University in 2020. In 2020, he moved to Wenzhou University and was promoted to lecturer in 2020. He is mainly engaged in the development of efficient and ultra-precision polishing technology and equipment for semiconductor materials such as silicon and silicon carbide, sapphire, zirconia ceramics, titanium alloy prostheses, aviation blades, etc., as well as the development of ultra-precision processing technology and equipment for optical lenses and reflectors.