In this study, Ti/Cu multilayer film was deposited by magnetron sputtering and then nitrided at 800 and 900 °C in N₂. The microstructure and wear performance were studied. The deposited Ti/Cu multilayer film mainly consisted of Ti and Cu phases. After nitriding, the film mainly consisted of Cu₄Ti₃, CuTi, and TiN phases, indicating the interface reaction and nitriding reaction occurring. The surface microstructure of the Ti/Cu multilayer film became denser after nitridation. The wear resistance of the Ti/Cu multilayer film improved after nitriding. After nitriding at 900 °C for 2 h, the maximum wear track depth of the multilayer film was ~0.73 μm, which is just 65% of the deposited Ti/Cu multilayer film. The wear mechanism of the Ti/Cu multilayer film before and after nitriding was abrasive and adhesive wear.