Yanpeng Gong received his B.S. degree in applied mathematics from Linyi University, Shandong, China in 2012, his M.S. degree in computational mathematics from Shandong University of Technology, Shandong, China, in 2015, and his Ph.D. degree in computational mechanics from Beijing Institute of Technology, Beijing, China, in 2019. He is currently a Associate Professor with the Institute of Electronics Packaging Technology and Reliability, Beijing University of Technology. He has authored more than 30 journal and conference papers. His current research interests include computational mechanics, high-performance computing, multiscale simulation, and model reduction techniques with special attention to semiconductor and electronic packaging structures.
Yanpeng Gong received his B.S. degree in applied mathematics from Linyi University, Shandong, China in 2012, his M.S. degree in computational mathematics from Shandong University of Technology, Shandong, China, in 2015, and his Ph.D. degree in computational mechanics from Beijing Institute of Technology, Beijing, China, in 2019. He is currently a Associate Professor with the Institute of Electronics Packaging Technology and Reliability, Beijing University of Technology. He has authored more than 30 journal and conference papers. His current research interests include computational mechanics, high-performance computing, multiscale simulation, and model reduction techniques with special attention to semiconductor and electronic packaging structures.