Thin ferroelectric Pb(Zr0.48Ti0.52)O3lead zirconate titanate films have been prepared on platinized silicon substrates via chemical solution deposition. The starting film-forming solutions were...

Microstructural and electrical properties of PZT (lead zirconate titanate) thin films prepared by sol-gel techniques at annealing temperatures in the range from 550°C to 900°C are studied. Perovskite (Pe) grain nucleation in PZT film starts but not completes at 550°C. Along with formation of round Pe (111) grains on the Pt (111) interface, the film contains small Pe and pyrochlore (Py) grains. Films annealed at the temperatures higher than 600°C demonstrate column structure of Pe grains, the amount of Py inclusions reduces with the annealing temperature and practically disappears at 700°C. An increase of annealing temperature leads to enhancement of (100) Pe orientation as a result of Ti diffusion on the Pt surface. Polarization decreases with the annealing temperature (maximum at 600°C), whereas permittivity increases up to the annealing temperature of 750°C.

Organosilicate glass-based porous low dielectic constant films with different ratios of terminal methyl to bridging organic (methylene, ethylene and 1,4-phenylene) groups are spin-on deposited by using a mixture of alkylenesiloxane with organic bridges and methyltrimethoxysilane, followed by soft baking at 120–200 °C and curing at 430 °C. The films’ porosity was controlled by using sacrificial template Brij^® L4. Changes of the films’ refractive indices, mechanical properties, k-values, porosity and pore structure versus chemical composition of the film’s matrix are evaluated and compared with methyl-terminated low-k materials. The chemical resistance of the films to annealing in oxygen-containing atmosphere is evaluated by using density functional theory (DFT). It is found that the introduction of bridging groups changes their porosity and pore structure, increases Young’s modulus, but the improvement of mechanical properties happens simultaneously with the increase in the refractive index and k-value. The 1,4-phenylene bridging groups have the strongest impact on the films’ properties. Mechanisms of oxidative degradation of carbon bridges are studied and it is shown that 1,4-phenylene-bridged films have the highest stability. Methylene- and ethylene-bridged films are less stable but methylene-bridged films show slightly higher stability than ethylene-bridged films.

Surfactant-templated porous organosilicate glass low-k films have been deposited by using a tetraethoxysilane (TEOS) and methyltriethoxysilane (MTEOS) mixture with different ratios and Brij® 30 surfactant. The deposited films contain different concentrations of terminal methyl groups that are proportional to the MTEOS concentration. Increasing the methyl group concentration by changing the TEOS/MTEOS ratio decreases the open porosity, k-value, and Young's modulus and increases the mean pore radius, although the template concentration was kept constant. The plasma etch rate well correlates with the number of fluorine atoms penetrated into pores. Plasma damage by fluorine radicals depends on the carbon concentration in the films. It can be reduced by 60% when the carbon concentration in the films exceeds 10 at. % as measured by XPS (the films deposited with the TEOS/MTEOS ratio of 40/60). Damage to the dielectrics associated with exposure to vacuum ultraviolet photons is reduced by more than 70% for the same samples.

Organosilicate-glass-based low-κ films containing both terminal methyl groups and an ethylene bridge between the silicon atoms are spin-on deposited by using 1,2-bis(trimethoxysilyl)ethane and methyltrimethoxysilane, Brij30 template, and thermal curing. The chemical composition, porosity, and internal defects are studied using Fourier-transform infrared spectroscopy, x-ray photoelectron spectroscopy, electron energy loss spectroscopy, UV induced luminescence, and ellipsometric porosimetry. It was found that the studied films contain oxygen-deficient centers (Si—Si bonds). The high defect density of the states near the valence-band edge of the studied low-κ films leads to a relatively small bandgap value of about 6.3 eV. The current–voltage characteristics at different temperatures were analyzed using six theoretical charge transport models where the transport is limited by the traps ionization. It was found that the best qualitative and quantitative agreement between the calculations and experimental data is achieved by using the model of phonon-assisted electron tunneling between the neutral traps and is supplemented by considering the space charge and charge carrier kinetics. Since the thermal and optical energies of the traps in the studied films are 1.6 eV and 3.2 eV, respectively, it is concluded that the traps are responsible for the charge transport in the Si—Si bonds.