It has been the conventional assumption that, due to the superlinear dependence of leakage power consumption on temperature, and widely varying on-chip temperature profiles, accurate leakage estimation requires detailed knowledge of thermal profile. Leakage power depends on integrated circuit (IC) thermal profile and circuit design style. The authors show that linear models can be used to permit highly-accurate leakage estimation over the operating temperature ranges in real ICs. The authors then show that for typical IC packages and cooling structures, a given amount of heat introduced at any position in the active layer will have similar impact on the average temperature of the layer. These two observations allow us to prove that, for wide ranges of design styles and operating temperatures, extremely fast, coarse-grained thermal models, combined with linear leakage power consumption models, permit highly-accurate system-wide leakage power consumption estimation. The results of our proofs are further confirmed via comparisons with leakage estimation based on detailed, time-consuming thermal analysis techniques. Experimental results indicate that the proposed technique yields a 59,259times-1,790,000times speedup in leakage power estimation while maintaining accuracy
4 November 2019 in IEEE Journal of Solid-State Circuits
STICKER is an energy-efficient convolutional neural network (NN) processor. It mainly improves energy efficiency by making full use of sparsity. The network sparsity can potentially lower storage and computation requirements. However, the sparsity distribution of both activations and weights ranges from 2% to 99% in different layers or models. Therefore, good support for the sparsity distribution is the key to improve the energy efficiency. Three new features are proposed in this article to support wide sparsity distribution efficiently. First, multi-sparsity control and data flow are implemented for finer sparsity granularity support. It can automatically switch the processor among nine sparsity modes for higher energy efficiency. Second, a multi-mode hierarchical data memory which can be reconfigured for networks with different sparsity modes is designed for higher storage efficiency. Third, a multi-sparsity-compatible set-associative convolution processing element (PE) array is designed to efficiently carry out convolution operations under different sparsity modes, especially when both activations and weights are sparse. STICKER was implemented in a 65-nm CMOS technology. With its wide-range sparsity-supported capacity, the peak energy efficiency reaches 62.1 TOPS/W when sparsity ratios of both activations and weights are 5%. In a completely pruned Alexnet model, STICKER achieves 2.82 TOPS/W energy efficiency 1.8x higher than that of the state-of-the-art processors.
25 June 2021 in IEEE Transactions on Circuits and Systems I: Regular Papers
Always-on intelligent visual perception applications are widely deployed in edges in the AIoT era. In order to eliminate power costs of data conversion and transmission, this paper proposes Senputing, an ultra-low-power processing-in-sensor chip that completely fuses sensing and computing together for a BNN-based hierarchical processing system. This chip could operate in two modes. In computation mode, photocurrents are directly utilized for computing without being converted into voltages, and the computation results of 1-st BNN layer are directly sent out to subsequent BNN processors for an always-on coarse classification, eliminating conversion power and storage cost of raw images. Once an interested objected is detected, this chip switches to sensor mode and sends raw images to potential full-precision processors or cloud servers for fine-grained recognition or segmentation. A $32\times 32$ prototype is fabricated with 180nm CMOS process. It accomplishes MNIST dataset classification task with the accuracy of 93.76% and the power consumption of 147nW at 156fps, achieving $13.1\times $ energy efficiency compared with state-of-the-art work.