Energy efficiency is becoming one of the most important topics in electronics. Among others, wide band-gap semiconductors can raise efficiency and lead to shrinking volumes in power conversion systems. As different markets have regulations that require different designs, it is necessary to cope with a large variety of similar designs. By using effective modeling and simulation strategies, the efforts of building these variants can be diminished, and re-designs can be avoided. In this paper, we present a universally valid way to come to reasonable simulation results for conducted emissions of a power electronic system in the frequency range from 150 kHz up to 400 MHz. After giving an overview of the state-of-the-art, the authors show how to implement and set up a simulation environment for a gallium-nitride (GaN) power converter. It shows how to differentiate between important and not that important components for Electromagnetic Compatibility (EMC), how to model these components, the printed circuit board, the load, and the setup, including the Line Impedance Stabilization Networks (LISNs), etc. Multiport S-parameter strategies as well as vector fitting methods are employed. Computational costs are kept low, and all simulations are verified with measurements; thus, this model is valid up to 400 MHz.

In this paper, common practice RF design guidelines for SMA edge mount connectors are investigated in terms of numerical simulations and VNA measurements. These guidelines are used in a variety of applications for coaxial-to-planar interfaces but often do not provide information regarding the physical origins of increased insertion and transmission losses. The presented results in this work focus on different RF PCB design features and their impact on electromagnetic field distributions in the launching zone. The presented investigations should raise awareness on the issue of electromagnetic field resonances occurring in the RF frequency range and assist PCB design engineers to identify potential issues occurring at an coaxial-to-planar interface. The investigated PCB features facilitate a high performance RF PCB design up to a frequency of 26 GHz.

Estimating the coupling properties between a radiating structure and other conductive elements, the field behavior of the radiating source is essential to know. One well-known classification of the field behavior are the field-regions around antennas, namely, the far-field, the radiating near-field, and the reactive near-field. The different kinds of near-fields are distinguished by the reactive and radiating parts of the electromagnetic field, whereas in the far-field region the field behaves as a plane wave in the direction of propagation. One way to describe these field characteristics is to use the complex Poynting vector, which defines the electromagnetic power flow. This work presents a Poynting-vector-based approach to classify and visualize the field behavior around simple radiators using numerical simulations. First, the approach is applied to simple antenna structures such as dipoles and loop antennas. Later, the introduced field regions are utilized to predict the coupling behavior of practical applications, the coupling between single elements of a linear antenna array, and the coupling behavior of an electrically large loop antenna. It could be shown that the introduced approach, defining a surface description of the boundary between the near-field regions, enables the possibility of predicting the coupling behavior between radiating structures. The introduced error estimator for the far-field also delivers knowledge about the far-field quality in different angular directions and distances. All simulations have been executed applying a one-dimensional partial element equivalent circuit method.