Filled high thermal conductivity epoxy composite solves the problem of the low thermal conductivity of the epoxy resin itself, but the addition of the thermal conductive filler reduces the mechanical properties of the composite, which limits its application in the field of high voltage insulation. In this work, carboxyl-terminated butadiene nitrile liquid rubber (CTBN) was used to toughen the boron nitride-epoxy hybrid system, and the effects of different contents of CTBN on the mechanical properties, thermal conductivity, glass transition temperature, thermal stability, and dielectric properties of the composites were investigated. The results showed that when the content of CTBN was 5–15 wt.%, the CTBN formed a dispersed island structure in the epoxy resin matrix. The toughness of the composite increased by about 32%, the breakdown strength was improved, and the thermal conductivity was about 160% higher than that of pure epoxy resin. As the CTBN content increased, the glass transition temperature and thermal stability of the composite decreased and the dielectric constant and the dielectric loss increased. When the CTBN content is 10–15 wt.%, a toughened epoxy composite material with better comprehensive properties is obtained.

Polymer-based composites are widely used in microelectronics and wireless communications, which require high thermal conductivity and low dielectric loss for effective heat dispersion and signal transmission.

Silicone rubber (SIR) has been widely used in electrical insulation fields, and the introduction of new materials is very important for the performance improvement of SIR composites. In this work, four different fillers, including aluminium hydroxide (ATH), yimonite (YMT), boron nitride (BN) and mica-filled SIR composites were prepared, and the vulcanization behavior, mechanical properties, insulation performance and hydrophobicity of the SIR composites were investigated and compared. Both BN- and mica-filled SIR composites showed excellent insulation performance, while the ATH-filled SIR composite exhibited the best mechanical properties with an elongation at break of 230% and a tensile strength of 2.9 MPa. The SIR/BN composite showed a breakdown strength of 29.2 kV/mm with a 5% failure rate. The addition of YMT deteriorated the insulation performance of SIR but improved the elongation at break and hydrophobicity, with an elongation at break increasing from 115% to 410% and the static contact angle improving from 109.8° to 115.6°.

SiC/EP composites are promising insulating materials due to their high thermal conductivity, stable chemical properties, and nonlinear electrical conductivity. However, the compatibility of micron-sized SiC particles with the organic polymer matrix is poor, and defects such as air gaps may be introduced at the interface, which reduces the partial discharge resistance of the composite materials. In order to improve the partial discharge initial voltage (PDIV) of SiC/EP composites, in this paper, SiC/EP composites with different proportions were prepared by surface modification of filler and compound of micro/nano particles. Firstly, a method of secondary modification of SiC particles was proposed, which was first modified by alkali washing and then silane coupling agent KH560, and the effectiveness of the modification was verified. Therefore, the interface bonding ability between the filler and the matrix was improved, the air gap defects at the interface were reduced, and the PDIV of the composite material was improved. When the filling ratio is 10 wt%, the PDIV was enhanced by 13.75%, and when the filling ratio was further increased, the improvement was reduced. In contrast, the introduction of nanoparticles into the composites can effectively improve the PDIV of composite materials. In this study, nanoparticles were used to form a shell-core structure in epoxy resins to exert their huge specific surface area and active surface properties, thereby changing the overall crosslinking properties of the composites. Through experimental research, the optimal micro-nano particle compounding ratio was explored. Under the optimal mixing ratio, the PDIV of the composite material can be increased by more than 90%.

In this paper, in order to improve the electrical and thermal properties of SiC/EP composites, the methods of compounding different crystalline SiC and micro-nano SiC particles are used to optimize them. Under different compound ratios, the thermal conductivity and breakdown voltage parameters of the composite material were investigated. It was found that for the SiC/EP composite materials of different crystal types of SiC, when the ratio of α and β silicon carbide is 1:1, the electrical performance of the composite material is the best, and the breakdown strength can be increased by more than 10% compared with the composite material filled with single crystal particles. For micro-nano compound SiC/EP composites, different total filling amounts of SiC correspond to different optimal ratios of micro/nano particles. At the optimal ratio, the introduction of nanoparticles can increase the breakdown strength of the composite material by more than 10%. Compared with the compound of different crystalline SiC, the advantage is that the introduction of a small amount of nanoparticles can play a strong role in enhancing the break-down field strength. For the filled composite materials, the thermal conductivity mainly depends on whether an effective heat conduction channel can be constructed. Through experiments and finite element simulation calculations, it is found that the filler shape and particle size have a greater impact on the thermal conductivity of the composite material, when the filler shape is rounder, the composite material can more effectively construct the heat conduction channel.

High-performance cross-linked polyethylene (XLPE) is currently employed in ultra-high-voltage direct current (UHVDC) cables, with the electrical tree being an important cause of DC cable breakdown. The comparison of XLPE samples under different manufacturing processes can provide a reference for the progress of cable production processes. This paper compares laboratory-prepared XLPE samples (DC-XLPE) with XLPE samples extracted from actual cables (Cable-XLPE) through electrical tree experiments, X-ray diffraction (XRD), and gel permeation chromatography (GPC). The experimental findings indicate that the breakdown time of DC-XLPE increased by nearly 50% compared to Cable-XLPE, with slower electrical tree growth and lower average discharge magnitude observed. Overall, DC-XLPE exhibited superior resistance to DC electrical tree and partial discharge. XRD and GPC analyses revealed minimal differences in crystallinity and grain size between the two types, with the primary distinction being DC-XLPE’s notably higher molecular weight and more concentrated molecular weight distribution. The differences in physicochemical properties may be attributed to more precise and uniform temperature control during the crosslinking process in laboratory settings, as well as a higher removal rate of crosslinking byproducts, ultimately leading to enhanced resistance to electrical tree and partial discharge in DC-XLPE.