Fengjiang Wang

Dr. Fengjiang Wang

orcid

Research Focus & Metrics

Academic Career Length

11Years (2016-Present)

(Calculated once Scilit publication data is synced: current year − year of first publication + 1)

Representative Publications

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10 January 2019 in Journal of Materials Science: Materials in Electronics
Verified
Journal Article
Closed access
PDF file
FWFengjiang Wang
Fengjiang Wang
HCHong Chen
Hong Chen
YHYing Huang
Ying Huang
LLLuting Liu
Luting Liu
ZZZhijie Zhang
Zhijie Zhang

9 August 2017 in Materials
Verified
Journal Article
Open access
PDF file
FWFengjiang Wang
Fengjiang Wang
YHYing Huang
Ying Huang
ZZZhijie Zhang
Zhijie Zhang
CYChao Yan
Chao Yan
Sn-Bi solder with different Bi content can realize a low-to-medium-to-high soldering process. To obtain the effect of Bi content in Sn-Bi solder on the microstructure of solder, interfacial behaviors in solder joints with Cu and the joints strength, five Sn-Bi solders including Sn-5Bi and Sn-15Bi solid solution, Sn-30Bi and Sn-45Bi hypoeutectic and Sn-58Bi eutectic were selected in this work. The microstructure, interfacial reaction under soldering and subsequent aging and the shear properties of Sn-Bi solder joints were studied. Bi content in Sn-Bi solder had an obvious effect on the microstructure and the distribution of Bi phases. Solid solution Sn-Bi solder was composed of the β-Sn phases embedded with fine Bi particles, while hypoeutectic Sn-Bi solder was composed of the primary β-Sn phases and Sn-Bi eutectic structure from networked Sn and Bi phases, and eutectic Sn-Bi solder was mainly composed of a eutectic structure from short striped Sn and Bi phases. During soldering with Cu, the increase on Bi content in Sn-Bi solder slightly increased the interfacial Cu6Sn5 intermetallic compound (IMC)thickness, gradually flattened the IMC morphology, and promoted the accumulation of more Bi atoms to interfacial Cu6Sn5 IMC. During the subsequent aging, the growth rate of the IMC layer at the interface of Sn-Bi solder/Cu rapidly increased from solid solution Sn-Bi solder to hypoeutectic Sn-Bi solder, and then slightly decreased for Sn-58Bi solder joints. The accumulation of Bi atoms at the interface promoted the rapid growth of interfacial Cu6Sn5 IMC layer in hypoeutectic or eutectic Sn-Bi solder through blocking the formation of Cu6Sn5 in solder matrix and the transition from Cu6Sn5 to Cu3Sn. Ball shear tests on Sn-Bi as-soldered joints showed that the increase of Bi content in Sn-Bi deteriorated the shear strength of solder joints. The addition of Bi into Sn solder was also inclined to produce brittle morphology with interfacial fracture, which suggests that the addition of Bi increased the shear resistance strength of Sn-Bi solder.

20 February 2025 in Journal of Materials Research and Technology
Verified
Journal Article
Open access
SLSijin Li
Sijin Li
XWXiaowei Wang
Xiaowei Wang
MLMingqing Liao
Mingqing Liao
ZLZezheng Li
Zezheng Li
QLQi Li
Qi Li
FWFengjiang Wang
Fengjiang Wang

24 October 2018 in Journal of Materials Science: Materials in Electronics
Verified
Journal Article
Closed access
PDF file
FWFengjiang Wang
Fengjiang Wang
LLLuting Liu
Luting Liu
DLDongyang Li
Dongyang Li
MWMingfang Wu
Mingfang Wu

8 May 2018 in Journal of Materials Science: Materials in Electronics
Verified
Journal Article
Closed access
PDF file
FWFengjiang Wang
Fengjiang Wang
HCHong Chen
Hong Chen
YHYing Huang
Ying Huang
CYChao Yan
Chao Yan

17 December 2024 in Journal of Materials Research and Technology
Verified
Journal Article
Open access
JZJunjie Zhao
Junjie Zhao
JWJun Wu
Jun Wu
JZJiayu Zhang
Jiayu Zhang
MLMingqin Liao
Mingqin Liao
FWFengjiang Wang
Fengjiang Wang