The degradation of ferroelectric (FE) properties of atomic layer deposited Hf0.5Zr0.5O2 films with increasing thickness was mitigated by inserting 1 nm-thick Al2O3 interlayer at middle position of the thickness of the FE film. The large Pr of 10 μC/cm2, which is 11 times larger than that of single layer Hf0.5Zr0.5O2 film with equivalent thickness, was achieved from the films as thick as 40 nm. The Al2O3 interlayer could interrupt the continual growth of Hf0.5Zr0.5O2 films, and the resulting decrease of grain size prevented the formation of non-ferroelectric monoclinic phase. The Al2O3 interlayer also largely decreased the leakage current of the Hf0.5Zr0.5O2 films.
For the utilization of graphene in various energy storage and conversion applications, it must be synthesized in bulk with reliable and controllable electrical properties. Although nitrogen-doped graphene shows a high doping efficiency, its electrical properties can be easily affected by oxygen and water impurities from the environment. We here report that boron-doped graphene nanoplatelets with desirable electrical properties can be prepared by the simultaneous reduction and boron-doping of graphene oxide (GO) at a high annealing temperature. B-doped graphene nanoplatelets prepared at 1000 °C show a maximum boron concentration of 6.04 ± 1.44 at %, which is the highest value among B-doped graphenes prepared using various methods. With well-mixed GO and g-B2O3as the dopant, highly uniform doping is achieved for potentially gram-scale production. In addition, as a proof-of-concept, highly B-doped graphene nanoplatelets were used as an electrode of an electrochemical double-layer capacitor (EDLC) and showed an excellent specific capacitance value of 448 F/g in an aqueous electrolyte without additional conductive additives. We believe that B-doped graphene nanoplatelets can also be used in other applications such as electrocatalyst and nano-electronics because of their reliable and controllable electrical properties regardless of the outer environment.