Yun Deng received his Ph.D. degree from Shanghai Jiao Tong University in 2006 and worked as a research fellow at Oregon State University from 2006 to 2007. He was a visiting scholar at Cornell University from 2013 to 2014. He has also been awarded the honorable titles of Shanghai Pujiang Program and Wilmar Excellent Young Scholar. His research has focused on the fields of food processing and packaging. In recent years, he has conducted the development, characterization, and application of innovative food processing and packaging techniques, including high hydrostatic pressure, heat pump drying, and biodegradable and edible packaging materials. He is also interested in the microstructure-function correlation of food macromolecules during processing. Over the years, Deng has published more than 70 peer-reviewed research papers and has been awarded more than 20 Chinese national patents. His main research was supported by grants from the Nation Key Technology R&D Program, NSFC, Shanghai STCSM, and industry.