In the present study, a high-performance n-type temperature sensor was developed by a new and facile synthesis approach, which could apply to ambient temperature applications. As impacted by the low sintering temperature of flexible polyimide substrates, a screen printing technology-based method to prepare thermoelectric materials and a low-temperature heat treatment process applying to polymer substrates were proposed and achieved. By regulating the preparation parameters of the high-performance n-type indium oxide material, the optimal proportioning method and the post-treatment process method were developed. The sensors based on thermoelectric effects exhibited a sensitivity of 162.5 μV/°C, as well as a wide range of temperature measurement from ambient temperature to 223.6 °C. Furthermore, it is expected to conduct temperature monitoring in different scenarios through a sensor prepared in masks and mechanical hands, laying a foundation for the large-scale manufacturing and widespread application of flexible electronic skin and devices.

In this study, thin-film thermocouples (TFTCs) were combined with a smart bolt to design a smart bolt that can directly test high temperature in service monitoring and parameter calculation for gas turbine structure design. The first-principles calculation was used to analyze the design of the surface properties of nickel-based alloys and insulating layers, and finite element analysis was used to optimize dimension parameters by controlling the thermal stress matching of insulating layers and sensitive layers. The effect of the glass powder with different particle sizes on the microstructure of the ITO and In₂O₃ films was studied via SEM. The preferred particle size of the additive glass powder is 400 nm. The XRD pattern shows the (222) peak has the highest intensity. The intensities of the (222) and (622) peaks increase after the heat treatment. The calibration results show that the average Seebeck coefficient of the TFTCs can reach 64.9 μV/°C at 1100 °C with a maximum voltage of 71.4 mV. The repeatability error of the cycles of the sensor after heat treatment is ±1.05%. The repeatability of the sensor is up to 98.95%. The smart bolts were tested for application in small aero engines. It can be seen that under the impact of 1000 °C, the thermal response of the prepared smart bolt is better than that of the K-type armored thermocouple, and the thermal balance is achieved faster. The intelligent bolt sensor proposed in this work has better engineering application prospects owing to its convenience of installation in harsh environments.

Thin-Film Thermocouples (TFTCs) are characterized by their high spatial resolutions, low cost, high efficiency and low interference on the air flow. However, the thermal stability of TFTCs should be further improved for application since their accuracy is influenced by joule heat and temperature time drift. In this paper, 3D molecular dynamics and finite element analysis are used for structural design. The effects of RF magnetron sputtering power and gas flow rate on conductivity and temperature time drift rate (DT) of high thermal stability tungsten–rhenium (95% W/5% Re vs. 74% W/26% Re) TFTCs were analyzed. According to the experimental results, the average Seebeck coefficient reached 31.1 µV/°C at 900 °C temperature difference (hot junction 1040 °C) with a repeatability error at ±1.37% in 33 h. The conductivity is 17.1 S/m, which is approximately 15.2 times larger than the compared tungsten-rhenium sample we presented, and the DT is 0.92 °C/h (1040 °C for 5 h), which is 9.5% of the old type we presented and 4.5% of compared ITO sample. The lumped capacity method test shows that the response time is 11.5 ms at 300 °C. This indicated an important significance in real-time temperature measurement for narrow spaces, such as the aero-engine combustion chamber.

To meet the need for micro-volume devices for high-precision measurement of temperature, Cu-Constantan (CuNi45) thin films with a novel array structure of thermo-electrodes were designed and fabricated. The thermo-electrodes on the probe-type substrate were deposited by magnetron sputtering technology and the profiling mask was prepared by 3D printing technology. The comprehensive performance of the temperature sensor was improved by systematic optimization of the heat treatment process and accuracy correction algorithm. Results showed that the sensor can measure with an accuracy of up to ±0.19%FS from −60 °C to 200 °C. The three-dimensional probe array temperature sensor shows great advantages in sensitivity, reliability resolution, stability, and measurement accuracy.