Hansong Liu

Dr. Hansong Liu

orcid

Research Focus & Metrics

Academic Career Length

7Years (2020-Present)

(Calculated once Scilit publication data is synced: current year − year of first publication + 1)

Representative Publications

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26 May 2024 in Materials
Verified
Journal Article
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CHChengyu Huang
Chengyu Huang
PZPeng Zhang
Peng Zhang
BLBo Li
Bo Li
MSMingchen Sun
Mingchen Sun
HLHansong Liu
Hansong Liu
Jianwen BaoJianwen Bao
Jianwen Bao
Carbon-fiber-reinforced polyimide (PI) resin composites have gained significant attention in the field of continuous-fiber-reinforced polymers, in which the interfacial bonding between carbon fiber and matrix resin has been an important research direction. This study designed and prepared a water-soluble thermoplastic polyamide acid sizing agent to improve the wettability of carbon fiber, enhance the van der Waals forces between carbon fiber and resin and strengthen the chemical bonding between the sizing agent and the alkyne-capped polyimide resin by introducing alkyne-containing functional groups into the sizing agent. This study found that the addition of a sizing layer effectively bridged the large modulus difference between the fiber and resin regions, resulting in the formation of an interfacial layer approximately 85 nm thick. This layer facilitated the transfer of stress from the matrix to the reinforced carbon fiber, leading to a significant improvement in the interfacial properties of the composites. Adjusting the concentration of the sizing agent showed that composites treated with 3% had the best interfacial properties. The interfacial shear strength increased from 82.08 MPa to 108.62 MPa (32.33%) compared to unsized carbon fiber. This research is significant for developing sizing agents suitable for carbon-fiber-reinforced polyimide composites.

5 December 2024 in Materials
Verified
Journal Article
Open access
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CHChengyu Huang
Chengyu Huang
JSJinsong Sun
Jinsong Sun
ZLZhiwei Liu
Zhiwei Liu
BLBo Li
Bo Li
MSMingchen Sun
Mingchen Sun
Jianwen BaoJianwen Bao
Jianwen Bao
Carbon fiber (CF)-reinforced polyimide (PI) resin matrix composites have great application potential in areas such as rail transport, medical devices, and aerospace due to their excellent thermal stability, dielectric properties, solvent resistance, and mechanical properties. However, the epoxy sizing agent used for traditional carbon fiber cannot withstand the processing temperature of polyimide resin, of up to 350 °C, resulting in the formation of pores or defects at the interface between the fiber and the resin matrix, leading to the degradation of the overall composite properties. To overcome this problem, in this study, a low-molecular-weight thermosetting polyimide sizing agent was prepared and the processability of the sized carbon fiber was optimized by a thermoplastic polyimide. Compared with the unsized carbon fiber polyimide composites, the interfacial properties of the composites after the polyimide sizing treatment were significantly improved, with the interfacial shear strength (IFSS) increasing from 82.08 MPa to 136.27 MPa, the interlaminar shear strength (ILSS) increasing from 103.7 to 124.9 MPa, and the bending strength increasing from 2262.2 MPa to 2562.1 MPa. The sizing agent acts as a bridge between the carbon fiber and polyimide resin, with anchorage and bonding at the interface between the fiber and resin, which are beneficial for enhancing the interface performance of composites.

1 December 2022 in Polymer Composites
Verified
Journal Article
Closed access
HLHansong Liu
Hansong Liu
JSJinsong Sun
Jinsong Sun
ZDZiqi Duan
Ziqi Duan
ZLZhaobo Liu
Zhaobo Liu
XMXiaoyi Ma
Xiaoyi Ma
JBJianwen Bao
Jianwen Bao

13 February 2025 in Materials
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Journal Article
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HWHAO WANG
HAO WANG
XZXIANGYU ZHONG
XIANGYU ZHONG
HJHe Jia
He Jia
LZLian-Wang Zhang
Lian-Wang Zhang
HLHansong Liu
Hansong Liu
SGSi-Cheng Ge
Si-Cheng Ge
This paper focuses on the transverse tensile and compressive mechanical properties of T800-grade unidirectional (UD) carbon fiber-reinforced polymers (CFRPs). Firstly, transverse tensile and compressive tests were conducted on UD composite laminates, yielding corresponding stress–strain curves. The results indicated that, for tension, the transverse tensile modulus, strength, and failure strain were 8.7 GPa, 64 MPa, and 0.74%, respectively, whereas for compression, these values were 8.4 GPa, 197.1 MPa, and 3.43%, respectively. The experimental curves indicated brittle failure under tensile loadings and significant plastic failure characteristics under compressive loading for the T800-grade composite. Subsequently, fractography experiments were performed to observe the fracture morphologies, revealing that tensile fractures were through-thickness cracks perpendicular to the loading direction, while compressive fractures were at a 52° angle to the loading direction. Finally, a micromechanical finite element method (FEM) was employed to simulate the tensile and compressive failure processes of the unidirectional composite, and the tensile and compressive properties were predicted. The simulation results showed that under both tensile and compressive loadings, interfacial elements failed first, causing stress concentration and damage to nearby resin elements. The damaged resin and interfacial elements expanded and connected, leading to ultimate failure. The predicted tensile stress–strain curve exhibited linear characteristics consistent with the experimental results in most regions but showed more pronounced nonlinearity before ultimate failure. The predicted compressive stress–strain curve aligned well with the experimental results in terms of nonlinearity. The predicted elastic modulus, failure strengths, and failure strains were in good agreement with the experimental results, with differences of 1.1% (tension modulus), 3.2% (tension strength), and 13.5% (tension failure strain), and 3.6% (compression modulus), −8.5% (compression strength), and −3.8% (compression failure strain). The final failure morphologies were in good accordance with the fractography experimental observations.

10 June 2022 in Materials
Verified
Journal Article
Open access
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PZPeng Zhang
Peng Zhang
HLHansong Liu
Hansong Liu
YYYilun Yao
Yilun Yao
TYTao Yang
Tao Yang
JSJinsong Sun
Jinsong Sun
LXLiying Xing
Liying Xing
Modified phenylethynyl terminated polyimides (PIs) were successfully prepared by using neodymium oxide (Nd2O3) via high-speed stirring and ultrasonic dispersion methods. In addition, the structure and properties of the Nd2O3-modified imide oligomers as well as the thermo-oxidative stability of the modified polyimides (PI/Nd2O3 hybrid) and its modification mechanism were investigated in detail. The thermogravimetric analysis (TGA) results indicated that the 5% decomposition temperature (Td5%) of the PI/Nd2O3 hybrids improved from 557 °C to 575 °C, which was also verified by the TGA-IR tests. Meanwhile, the weight loss rate of the PI/Nd2O3 hybrids significantly decreased by 28% to 31% compared to that of pure PI under isothermal aging at 350 °C for 450 h when the added content of Nd2O3 was between 0.4 wt% and 1 wt%, showing outstanding thermo-oxidative stability. Moreover, the mechanism of the enhanced thermo-oxidative stability for the modified PIs was analyzed by scanning electron microscopy (SEM) and X-ray diffraction (XRD).

27 January 2023 in Polymers
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Journal Article
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PZPeng Zhang
Peng Zhang
YDYadong Dai
Yadong Dai
HLHansong Liu
Hansong Liu
BDBotao Dong
Botao Dong
YYYilun Yao
Yilun Yao
Jianwen BaoJianwen Bao
Jianwen Bao
A polyimide (PI) molecular model was successfully constructed to compare the performance of PIs with different structures. In detail, the structure of the cross-linked PI resin, the prepolymer melt viscosity, and the glass-transition temperature (Tg) were investigated using molecular simulations. The results indicate that benzene ring and polyene-type cross-linked structures dominate the properties of the PIs. Moreover, the prepolymer melt viscosity simulations show that the 6FDA-APB and the ODPA-APB systems have a low viscosity. The results for the Tg and the distribution dihedral angle reveal that the key factor affecting bond flexibility may be the formation of a new dihedral angle after cross-linking, which affects the Tg. The above results provide an important reference for the design of PIs and have important value from the perspective of improving the efficiency of new product development.