Recently, polymeric nanofiber veils have gained lot of interest for various industrial and research applications. Embedding polymeric veils has proven to be one of the most effective ways to prevent delamination caused by the poor out-of-plane properties of composite laminates. The polymeric veils are introduced between plies of a composite laminate, and their targeted effects on delamination initiation and propagation have been widely studied. This paper presents an overview of the application of nanofiber polymeric veils as toughening interleaves in fiber-reinforced composite laminates. It presents a systematic comparative analysis and summary of attainable fracture toughness improvements based on electrospun veil materials. Both Mode I and Mode II tests are covered. Various popular veil materials and their modifications are considered. The toughening mechanisms introduced by polymeric veils are identified, listed, and analyzed. The numerical modeling of failure in Mode I and Mode II delamination is also discussed. This analytical review can be used as guidance for veil material selection, for estimation of the achievable toughening effect, for understanding the toughening mechanism introduced by veils, and for the numerical modeling of delamination.

The problem of icing for surfaces of engineering structures requires attention more and more every year. Active industrialization in permafrost zones is currently underway; marine transport in Arctic areas targets new goals; the requirements for aerodynamically critical surfaces of wind generators and aerospace products, serving at low temperatures, are increasing; and fiber-reinforced polymer composites find wide applicability in these structural applications demanding the problem of anti/de-icing to be addressed. The traditional manufacturing approaches are superimposed with the new technologies, such as 3D printers and robotics for laying heat wires or cheap and high-performance Thermal Sprayed methods for metallic cover manufacturing. Another next step in developing heaters for polymer structures is nano and micro additives to create electrically conductive heating networks within. In our study, we review and comparatively analyze the modern technologies of structure heating, based on resistive heating composites.

As technology advances toward ongoing circuit miniaturization and device size reduction followed by improved power density, heat dissipation is becoming a key challenge for electronic equipment. Heat accumulation can be prevented if the heat from electrical equipment is efficiently exported, ensuring a device’s lifespan and dependability and preventing otherwise possible mishaps or even explosions. Hence, thermal management applications, which include altering the role of aerogels from thermally insulative to thermally conductive, have recently been a hot topic for 3D-aerogel-based thermal interface materials. To completely comprehend three-dimensional (3D) networks, we categorized and comparatively analyzed aerogels based on carbon nanomaterials, namely fibers, nanotubes, graphene, and graphene oxide, which have capabilities that may be fused with boron nitride and impregnated for better thermal performance and mechanical stability by polymers, including epoxy, cellulose, and polydimethylsiloxane (PDMS). An alternative route is presented in the comparative analysis by carbonized cellulose. As a result, the development of structurally robust and stiff thermally conductive aerogels for electronic packaging has been predicted to increase polymer thermal management capabilities. The latest trends include the self-organization of an anisotropic structure on several hierarchical levels within a 3D framework. In this study, we highlight and analyze the recent advances in 3D-structured thermally conductive aerogels, their potential impact on the next generation of electronic components based on advanced nanocomposites, and their future prospects.

In this study, three-dimensional (3D) polyvinyl alcohol (PVA)/aligned boron nitride (BN) aerogel framework nanocomposites with high performance were fabricated by a facile strategy. The boron nitride powder was initially hydrolyzed and dispersed with a chemically crosslinked plasticizer, diethyl glycol (DEG), in the PVA polymer system. The boron nitride and DEG/PVA suspensions were then mixed well with different stoichiometric ratios to attain BN/PVA nanocomposites. Scanning electron microscopy revealed that BN platelets were well dispersed and successfully aligned/oriented in one direction in the PVA matrix by using a vacuum-assisted filtration technique. The formed BN/PVA aerogel cake composite showed excellent in-plane and out-of-plane thermal conductivities of 0.76 W/mK and 0.61 W/mK with a ratio of BN/PVA of (2:1) in comparison with 0.15 W/mK for the pure PVA matrix. These high thermal conductivities of BN aerogel could be attributed to the unidirectional orientation of boron nitride nanoplatelets with the post-two days vacuum drying of the specimens at elevated temperatures. This aerogel composite is unique of its kind and displayed such high thermal conductivity of the BN/PVA framework without impregnation by any external polymer. Moreover, the composites also presented good wettability results with water and displayed high electrical resistivity of ~10¹⁴ Ω cm. These nanocomposites thus, with such exceptional characteristics, have a wide range of potential uses in packaging and electronics for thermal management applications.

Polymer nanocomposites have been extensively used in the electronic industry as thermal interface materials (TIMs) and thermal management materials owing to their sought-after properties related to thermal conductivity and electrical insulation. Typical TIMs include thermal pads and grease; however, thermal papers/films are rapidly getting popular for their remarkable properties like mechanical strength and extraordinary thermal conductivity (TC). Papery films with merits, including simple processing reduced optimized thickness, and enhanced flexibility, are emerging as a new class of materials for thermal management applications in electronics. Thus, even higher loading concentrations of thermally conductive fillers, as high as 95 wt.%, could achieve a tremendous TC with practically no deterioration in the mechanical integrity of composite films, something that was previously known to be a major problem in conventional polymer nanocomposites. In this review, we shall highlight and discuss the latest progress in thermally conductive papers/tapes/thin films and their possible impact on the next-generation electronic components relying on advanced nanotechnologies, and, discuss how these advancements have helped resolving the setbacks related to conventional thermal interface materials, thereby making the thermally conductive thin films/papers a viable solution for future microelectronics.