Efficient cooling of silicon chips using microfin structures made of aligned multiwalled carbon nanotube arrays is achieved. The tiny cooling elements mounted on the back side of the chips enable power dissipation from the heated chips on the level of modern electronics demands. The nanotube fins are mechanically superior compared to other materials being ten times lighter, flexible, and stiff at the same time. These properties accompanied with the relative simplicity of the fabrication makes the nanotube structures strong candidates for future on-chip thermal management applications.
TiO2 nanofibers decorated with Pt and Pd nanoparticles have been synthesized and studied in various photocatalytic processes. Excellent photocatalytic behavior in the decomposition of organic dyes in water, degradation of organic stains on the surface of flexible freestanding cellulose/catalyst composite films and in generation of hydrogen from ethanol using both suspended and immobilized catalysts are demonstrated. The performance of the nanofiber-based TiO2 materials is competitive with—and in some cases outperforms—their conventional nanoparticle-based counterparts. In all cases, Pd-decorated TiO2 nanoparticles and nanofibers proved to be more efficient than their Pt-based counterparts, which could be explained on the basis of the formation of nano-sized Schottky interfaces at the contacts between TiO2 and metal nanoparticles. The feasibility of forming cellulose/catalyst composites provides a novel way of utilizing photocatalyst materials in large-area coatings and freestanding films.
The structural changes of porous silicon (PS) samples during oxidation are investigated and analyzed using various microscopy techniques and x-ray diffraction. It is found that the surface roughness of oxidized PS layers increases with the oxidation at and decreased at . At a partially fused surface is observed. The oxide formed on the wall of porous silicon skeleton is amorphous. The shifts of Si(400) peaks are observed in the x-ray diffraction patterns, which are correlated to the lattice deformation induced by thermal expansion coefficient mismatch between the grown and the residual Si, and to the intrinsic stress caused by the Si–O bonds at the interface. These explanations are supported by thermomechanical modeling using three-dimensional finite element method.