C.Y. Khor (Chu Yee Khor) received a bachelor degree in mechanical engineering and M.Sc and Ph.D. degrees in Mechanical Engineering, specializing in electronic packaging, from Universiti Sains Malaysia, Minden, Malaysia, in 2008, 2010 and 2013, respectively. He was a Post-Doctoral Fellow at School of Mechanical Engineering, Universiti Sains Malaysia, in 2014. Currently, he is a senior lecturer at the Faculty of Engineering Technology, Universiti Malaysia Perlis (UniMAP), Perlis, Malaysia. Dr Khor is a journal reviewer for Microelectronics Reliability, Heat and Mass Transfer, the International Journal of Heat and Mass Transfer, the Arabian Journal for Science and Engineering, Soldering & Surface Mount Technology, the Journal of Electronic Packaging, Microelectronics International, etc.