To facilitate cost-effective and elastic computing benefits to the cloud users, the energy-efficient and secure allocation of virtual machines (VMs) plays a significant role at the data center. The inefficient VM placement (VMP) and sharing of common physical machines among multiple users leads to resource wastage, excessive power consumption, increased intercommunication cost, and security breaches. To address the aforementioned challenges, a novel secure and multiobjective VMP (SM-VMP) framework is proposed with an efficient VM migration. The proposed framework ensures an energy-efficient distribution of physical resources among VMs, which emphasizes secure and timely execution of user application by reducing intercommunication delay. The VMP is carried out by applying the proposed Whale Optimization Genetic Algorithm (WOGA), inspired by whale evolutionary optimization and nondominated sorting based genetic algorithms. The performance evaluation for static and dynamic VMP and comparison with recent state of the arts observed a notable reduction in shared servers, intercommunication cost, power consumption, and execution time up to 28.81%, 25.7%, 35.9%, and 82.21%, respectively with increased resource utilization up to 30.21%.
27 September 2018 in IEEE Transactions on Emerging Topics in Computing
This paper presents two novel low cost, double-and-triple-node-upset tolerant latch designs. First, a novel low cost and double-node-upset (DNU) completely tolerant (LCDNUT) latch design is proposed. The latch mainly comprises a storage module (SM) feeding back to a 3-input C-element. The SM mainly consists of eight input-split inverters. Since the inputs of the C-element cannot be simultaneously flipped, the latch tolerates any DNU in the SM. When a single node in the SM and the output node are affected, the latch can self-recover from the DNU. Second, to completely tolerate any triple-node-upset (TNU), by replacing the C-element in the LCDNUT latch with a two-level error-interceptive module constructed from triple C-elements, a novel low cost and TNU completely tolerant (LCTNUT) latch design is proposed. Simulation results demonstrate the robustness of the proposed latches. Furthermore, due to the use of a high-speed transmission path, the clock-gating technology and fewer transistors, the proposed LCTNUT latch reduces the delay-power-area product by approximately 99.39% and has a low sensitivity to the process-voltage-and-temperature variation effects, compared with currently the only TNU completely tolerant latch design.
In nano-scale CMOS technologies, storage cells such as latches are becoming increasingly sensitive to triple-node-upset (TNU) errors caused by harsh radiation effects. In the context of information assurance through redundant design, this paper proposes a novel low-cost and TNU on-line self-recoverable latch design which is robust against harsh radiation effects. The latch mainly consists of a series of mutually interlocked 3-input Muller C-elements (CEs) that form a circularly linked schematic. The output of any CE in the latch respectively feeds back to one input of some specified downstream CEs, making the latch completely self-recoverable from any possible TNU, i.e., the latch is completely TNU-resilient. Simulation results demonstrate the complete TNU-resiliency of the proposed latch. In addition, due to the use of fewer transistors and a high-speed path, the proposed latch reduces the delay-power-area product by approximately 91% compared with the state-of-the-art TNU hardened latch (TNUHL), which cannot provide a complete TNU-resiliency.
2 July 2019 in IEEE Transactions on Aerospace and Electronic Systems
In harsh radiation environments, nanoscale CMOS latches have become more and more vulnerable to triple-node upsets (TNUs). This paper first proposes a latch design that can self-recover from any possible TNU for aerospace applications in the 16-nm CMOS technology. The proposed latch is mainly constructed from seven mutually feeding-back soft-error-interceptive modules (SIMs), any of which consists of two three-input C-elements and one two-input C-element. Due to the mutual feedback mechanism of SIMs and the dual-level soft-error interception of each SIM, the latch can self-recover from any possible TNU. Simulation results demonstrate the TNU self-recoverability from any key TNU for the proposed latch using redundant silicon area. Furthermore, using a high-speed path, the proposed latch saves about 95.45% transmission delay and 86.97% delay-power-area product, compared with the state-of-the-art TNU-tolerant latch that cannot provide complete TNU self-recoverability at all.
22 September 2020 in IEEE Transactions on Emerging Topics in Computing
With the rapid advancement of CMOS technologies, nano-scale CMOS latches have become increasingly sensitive to multiple-node upset (MNU) errors caused by radiations. First, this paper proposes a novel latch design, namely QNUTL that can completely tolerate MNUs such as double-node upsets, triple-node upsets (TNUs), and even quadruple-node upsets (QNUs). The latch is mainly constructed from three dual-interlocked-storage-cells (DICEs) and a triple-level soft-error interceptive module (SIM) that consists of six 2-input C-elements. Due to the single-node-upset self-recoverability of DICEs and the soft-error interception of the SIM, the latch can completely tolerate any QNU. Next, by replacing the DICEs in the QNUTL latch by clock-gating (CG) based ones, a QNUTL-CG latch is proposed to significantly reduce power consumption. Simulation results demonstrate the MNU-tolerance of the proposed latches. Moreover, owing to the use of a high-speed transmission path, clock-gating, and a few transistors, the proposed QNUTL-CG latch has low overhead in terms of area, D-Q delay, CLK-Q delay, and setup time, compared with the state-of-the-art TNU-tolerant latch (TNUTL) which is not QNU-tolerant.
8 October 2019 in IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems
Due to the winding level of the thinned wafers and the surface roughness of silicon dies, the quality of through-silicon vias (TSVs) varies during the fabrication and bonding process. If one TSV exhibits a defect during its manufacturing process, the probability of multiple defects occurring in the TSVs neighboring the faulty TSV increases, i.e., the TSV defects tend to be clustered, which significantly reduces the yield of 3-D integrated circuit. To resolve the clustered TSV faults, router-based, ring-based, group-based, and cellular-based redundant TSV (RTSV) architectures were proposed. However, the repair rate is low and the hardware overhead as well as delay overhead is high. In this article, we propose a honeycomb-based RTSV architecture to utilize the area and delay more efficiently as well as to maintain high yield. The simulation results show that the proposed architecture has a 99.84% repair rate for uniform faults and an 81.42% repair rate for highly clustered faults. The proposed design achieves a 51.66% reduction of hardware overhead compared with the router-based design and a 20.69%, 46.93%, 34.17%, and 11.15% reduction of total delay compared with ring-based, router-based, group-based, and cellular-based methods, respectively.