Chengyi Song

Prof. Dr. Chengyi Song

orcid

Research Focus & Metrics

Academic Career Length

25Years (2002-Present)

(Calculated once Scilit publication data is synced: current year − year of first publication + 1)

Representative Publications

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23 March 2015 in Advanced Materials
Verified
Journal Article
Closed access
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YLYanming Liu
Yanming Liu
SYShengtao Yu
Shengtao Yu
RFRui Feng
Rui Feng
ABAntoine Bernard
Antoine Bernard
YLYang Liu
Yang Liu
TDTao Deng
Tao Deng

3 February 2023 in Science
Verified
Journal Article
Closed access
QSQingchen Shen
Qingchen Shen
MJModi Jiang
Modi Jiang
RWRuitong Wang
Ruitong Wang
KSKexian Song
Kexian Song
MVMan Hou Vong
Man Hou Vong
TDTao Deng
Tao Deng
Soft materials tend to be highly permeable to gases, making it difficult to create stretchable hermetic seals. With the integration of spacers, we demonstrate the use of liquid metals, which show both metallic and fluidic properties, as stretchable hermetic seals. Such soft seals are used in both a stretchable battery and a stretchable heat transfer system that involve volatile fluids, including water and organic fluids. The capacity retention of the battery was ~72.5% after 500 cycles, and the sealed heat transfer system showed an increased thermal conductivity of approximately 309 watts per meter-kelvin while strained and heated. Furthermore, with the incorporation of a signal transmission window, we demonstrated wireless communication through such seals. This work provides a route to create stretchable yet hermetic packaging design solutions for soft devices.

12 September 2021 in Advanced Materials
Verified
Journal Article
Closed access
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HWHan Wang
Han Wang
WXWenkui Xing
Wenkui Xing
SCShen Chen
Shen Chen
CSChengyi Song
Chengyi Song
MDMichael Dickey
Michael Dickey
TDTao Deng
Tao Deng

27 September 2022 in Nanomaterials
Verified
Journal Article
Open access
PDF file
WXWenkui Xing
Wenkui Xing
YXYue Xu
Yue Xu
CSChengyi Song
Chengyi Song
TDTao Deng
Tao Deng
With the increased level of integration and miniaturization of modern electronics, high-power density electronics require efficient heat dissipation per unit area. To improve the heat dissipation capability of high-power electronic systems, advanced thermal interface materials (TIMs) with high thermal conductivity and low interfacial thermal resistance are urgently needed in the structural design of advanced electronics. Metal-, carbon- and polymer-based TIMs can reach high thermal conductivity and are promising for heat dissipation in high-power electronics. This review article introduces the heat dissipation models, classification, performances and fabrication methods of advanced TIMs, and provides a summary of the recent research status and developing trends of micro- and nanoscale TIMs used for heat dissipation in high-power electronics.

10 September 2018 in ACS Energy Letters
Verified
Journal Article
Closed access
QXQian Xiang
Qian Xiang
FLFan Li
Fan Li
WCWenlong Chen
Wenlong Chen
YMYanling Ma
Yanling Ma
YWYi Wu
Yi Wu
JWJianbo Wu
Jianbo Wu

21 March 2019 in Energy & Environmental Science
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Journal Article
Closed access
PDF file
Peng TaoPeng Tao
Peng Tao
CCChao Chang
Chao Chang
ZTZhen Tong
Zhen Tong
HBHua Bao
Hua Bao
CSChengyi Song
Chengyi Song
TDTao Deng
Tao Deng
Magnetically-accelerated optical charging doubles solar-thermal energy harvesting rates while fully maintaining the storage capacity of high-temperature molten salt phase change materials.