The morphology and growth kinetics of intermetallic compounds formed at the interface between liquid indium and silver substrates in the temperature range from 473 K to 673 K were studied. Electron microprobe (EPMA) analysis and x-ray diffraction (XRD) revealed that the intermetallic compound Ag₂In formed as scallops. The growth followed parabolic kinetics, suggesting that the growth was diffusion-controlled. Moreover, the activation energy calculated from the Arrhenius plot of growth reaction constants was 41.55 KJ/mole. Also, the relationship between the wettability of liquid indium on the surface of silver substrates and their interfacial reactions was clarified.