Glass has emerged as a highly versatile substrate for various sensor and MEMS packaging applications, including electromechanical, thermal, optical, biomedical, and RF devices, due to its exceptional properties such as high geometrical tolerances, outstanding heat and chemical resistance, excellent high-frequency electrical properties, and the ability to be hermetically sealed. In these applications, Through Glass Via (TGV) technology plays a vital role in manufacturing and packaging by creating electrical interconnections through glass substrates. This paper provides a comprehensive summary of the research progress in TGV fabrication along with its integrations, including through via formation and metallization. This paper also reviews the significant qualification and reliability achievements obtained by the scientific community for TGV technology. Additionally, this paper summarizes the application of TGV technology in various sensors such as MEMS sensors and discusses the potential applications and future development directions of TGV technology.

Three-dimensional (3D) interconnection technology based on glass through vias (TGVs) has been used to integrate passive devices, and optoelectronic devices due to its superior electrical qualities, outstanding mechanical stability, and lower cost. Nevertheless, the performance and reliability of the device will be impacted by the thermal stress brought on by the mismatch of the coefficient of thermal expansion among multi-material structures and the complicated structure of TGV. This paper focuses on thermal stress evolution in different geometric and material parameters and the development of a controlled method for filling polymers in TGV interconnected structures. In addition, a numerical study based on the finite element (FE) model has been conducted to analyze the stress distribution of the different thicknesses of TGV-Cu. Additionally, a TGV interconnected structure model with a polymer buffer layer is given to solve the crack problem appearing at the edge of RDL. Meanwhile, after practical verification, in comparison to the experimental results, the FE model was shown to be highly effective and accurate for predicting the evolution of stress, and several recommendations were made to alleviate stress-related reliability concerns. An improved manufacturing process flow for the TGV interconnected structure was proposed and verified as feasible to address the RDL crack issue based on the aforementioned research. It provides helpful information for the creation of highly reliable TGV connection structures.

This paper presents a comprehensive review of advancements in wafer-level packaging (WLP) technology, with a particular focus on its application in surface acoustic wave (SAW) and bulk acoustic wave (BAW) filters. As wireless communication systems continue to evolve, there is an increasing demand for higher performance and miniaturization, which has made acoustic wave devices—especially SAW and BAW filters—crucial components in the Radio Frequency (RF) front-end systems of mobile devices. This review explores key developments in WLP technology, emphasizing novel materials, innovative structures, and advanced modeling techniques that have enabled the miniaturization and enhanced functionality of these filters. Additionally, the paper discusses the role of WLP in addressing challenges related to size reduction and integration, facilitating the creation of multi-functional devices with low manufacturing costs and high precision. Finally, it highlights the opportunities and future directions of WLP technology in the context of next-generation wireless communication standards.

Glass has emerged as a highly versatile substrate for various sensor and MEMS packaging applications, including electromechanical, thermal, optical, biomedical, and RF devices, due to its exceptional properties such as high geometrical tolerances, outstanding heat and chemical resistance, excellent high-frequency electrical properties, and the ability to be hermetically sealed. In these applications, Through-Glass-Via (TGV) plays a vital role in manufacturing and packaging by creating electrical interconnections through glass substrates. This paper provides a comprehensive summary of the research progress in TGV fabrication along with their integrations, including through-via formation and metallization. The paper also reviews the significant qualification and reliability achievements obtained by the scientific community for TGV. Additionally, the paper summarizes the application of TGV technology in various sensors.