3-D mask with a vacuum filtration system allows efficient fabrication of complex Ag nanowire patterns with clear edges.

The effects of Ag nanoparticle (Ag NP) addition on interfacial reaction and mechanical properties of Sn–58Bi solder joints using ultra-fast laser soldering were investigated. Laser-assisted low-temperature bonding was used to solder Sn–58Bi based pastes, with different Ag NP contents, onto organic surface preservative-finished Cu pads of printed circuit boards. The solder joints after laser bonding were examined to determine the effects of Ag NPs on interfacial reactions and intermetallic compounds (IMCs) and high-temperature storage tests performed to investigate its effects on the long-term reliabilities of solder joints. Their mechanical properties were also assessed using shear tests. Although the bonding time of the laser process was shorter than that of a conventional reflow process, Cu–Sn IMCs, such as Cu₆Sn₅ and Cu₃Sn, were well formed at the interface of the solder joint. The addition of Ag NPs also improved the mechanical properties of the solder joints by reducing brittle fracture and suppressing IMC growth. However, excessive addition of Ag NPs degraded the mechanical properties due to coarsened Ag₃Sn IMCs. Thus, this research predicts that the laser bonding process can be applied to low-temperature bonding to reduce thermal damage and improve the mechanical properties of Sn–58Bi solders, whose microstructure and related mechanical properties can be improved by adding optimal amounts of Ag NPs.

High-performance oxygen evolution reaction (OER) electrocatalysts are needed to produce hydrogen for energy generation through a carbon-free route. In this work, the solution combustion synthesis (SCS) method was employed to synthesize mixed phases of Co- and Mn-based oxides, and the relationships between the crystalline structure and the catalytic properties in the mixed phases were established. The mixed phases of Co- and Mn-based oxides shows promising OER properties, such as acceptable overpotential (450 mV for 10 mA∙cm−2) and Tafel slope (35.8 mV∙dec−1), highlighting the use of the mixed phases of Co- and Mn-based oxides as a new efficient catalysts for water splitting. Electronic structure of the mixed phases of Co- and Mn based oxides is studied in detail to give insight for the origin of high catalytic activities. In addition, excellent long-term stability for OER in alkaline media is achieved for the mixed phase of Co- and Mn based oxides.

The exemption of Pb-bearing automobile electronics in the End of Life Vehicle (ELV) directive has recently expired, bring an urgent need to find Pb-free alloys that can maintain good performance under high-temperature and vibration conditions for automobile application. In this study, a new lead-free solder, Sn-0.7Cu-0.2Cr (wt.%) alloy, was developed. To evaluate the thermomechanical reliability of the new solder alloy in automobile electronics, a thermal shock test was performed. The results show that the presence of Cr in solder inhibits the growth of interfacial Cu₃Sn layer and the formation of Kirkendall voids, which effectively improves the joint reliability under intense thermal shock condition compared with the commercial SAC305 and SC07 solders. Specifically, the shear strength of the Sn-0.7Cu-0.2Cr/Cu solder joints was higher by 23% and 44% than that of SAC305 and SC07 solder joints after 2000 cycles of thermal shock at 1 m/s shear speed.