Using high-speed through-silicon via (TSV) channels is a potential means of utilizing 3-D interconnections to realize considerable high-bandwidth throughput in vertically stacked and laterally distributed integrated circuits. However, although the TSV and a silicon interposer in a high-speed TSV channel lead to a significant decrease of the interconnect length, the received digital signal after transmission through a TSV channel is still degraded at a high data-rate due to the nonidealities of the channel. Therefore, an analysis of the signal integrity in a high-speed TSV channel is necessary. In this paper, a single-ended high-speed TSV channel is measured and analyzed in the frequency-domain and the time-domain. To measure the high-speed TSV channel, two types of test vehicles are fabricated, consisting of TSVs and interposers. With these test vehicles, the channel losses are measured in the frequency-domain up to 20 GHz, and eye-diagrams are measured in the time-domain at 1 Gb/s and 10 Gb/s. Based on these measurements, the channel loss, characteristic impedance, and reflection of the high-speed TSV channel are analyzed and compared to those of the channel in multichip module (MCM) package. Because of the losses from the silicon-substrate and the thin oxide-layer used in the TSVs, the overall loss of the high-speed TSV channel is higher than that of the MCM channel. In addition, the characteristic impedance of the high-speed TSV channel is frequency-dependent, whereas that of the MCM channel is frequency-independent. Moreover, in contrast to the MCM channel, the reflection is negligible in the high-speed TSV channel because the channel is too short and the losses are too high to be affected by the reflection. Finally, the design guidance of a high-speed TSV channel for wide bandwidth is determined based on the analysis of the measurements.

In this paper, a low-cost CMOS ultra-wideband (UWB) impulse transmitter module with a compact form factor is proposed for impulse-radio communications. The module consists of a CMOS impulse generator, a compact bandpass filter (BPF), and a printed planar UWB antenna. The impulse generator is designed using a Samsung 0.35-/spl mu/m CMOS process for low-cost and low-power fabrication. The measurement shows the fabricated chip makes a train of sharp triangular pulses with a peak voltage of about 2.8 V under the supply voltage of 3.3 V. To make an impulse fit the Federal Communications Commission (FCC) spectrum mask, the compact BPF is developed using a coupled strip line and a tapered stub. Also, the compact planar UWB antenna is developed. All of the components of the UWB transmitter module are fabricated on a single package using system-on-package technology for miniaturization. The proposed UWB transmitter is tested in an office environment. The measured results show that the generated UWB signal meets the FCC regulation, and the peak-to-peak amplitude of received UWB signal at 1-m distance on line of sight is 16 mVpp with a 10-dB-gain low-noise amplifier in the receiver.

In this paper, we present the analytical expressions of the resonant peaks of input impedance and the frequencies of maximum transferred power in the wireless power transfer systems in case of tight magnetic coupling. The analytical expressions predict the frequencies of power source where the maximum power is transferred in both cases of the constant AC voltage source and the constant AC current source. We prove that the resonant frequencies of the input impedance in the wireless power transfer systems coincide with the frequencies at which the transferred power is maximized for the constant AC voltage source and the constant AC current source. The test vehicles of the coupled rectangular coils are simulated with 3D EM solver and fabricated on printed circuit boards. Experimentally, it is verified that the analytical expressions predict the changes in the resonant peaks of input impedance of the wireless power transfer systems, its relationship with frequencies of maximum transferred power and their dependency with the source type in the wireless power transfer systems.

In this paper, we propose a compact and wideband electromagnetic bandgap (EBG) structure using a defected ground structure (DGS) to significantly enhance the wideband suppression of power/ground noise coupling in multilayer packages and printed circuit boards. The proposed EBG structure is implemented simply by adding a rectangular-shaped DGS which is etched periodically onto the ground plane without changing any other geometrical parameter from a mushroom-type EBG structure. The DGS effects on the f_L and f_U are thoroughly analyzed using the dispersion characteristics. We experimentally verified that the proposed EBG structure achieved the wideband power/ground noise suppression (below -40 dB) between 2.5 and 16.2 GHz. In addition, we demonstrated the considerable reduction in f_L from 3.4 to 2.5 GHz and a significant increase in f_U from 9.1 to 16.2 GHz when compared with the mushroom-type EBG structure.

We propose a new analysis method to determine the bandgap characteristics of an electromagnetic bandgap structure with a defected ground structure (DGS). The proposed method is based on a 1-D segmented transmission line model and a piecewise linear approximation of Zo within a unit cell. Although the previous method is only applicable to rectangular DGSs (RDGSs), the proposed method is applicable to any DGS shapes. As an example, the proposed method is applied to a circular DGS and shows a good agreement with full-wave simulations of the unit cell and measurements of 11 × 11 unit cells. The circular DGS achieves a 15% improvement in the stopband bandwidth over the RDGS with the same perforation area. The proposed method allows us to explore a variety of DGS shapes in the search for better stopband characteristics. It also offers the basis for numerical optimization techniques to be used in synthesizing DGS shapes to meet required stopband characteristics.

In this letter, we propose a miniaturized and wideband electromagnetic bandgap (EBG) structure with a meander-perforated plane (MPP) for power/ground noise suppression in multilayer printed circuit boards. The proposed MPP enhances the characteristic impedance of the EBG unit cell and improves the slow-wave effect, thus achieving the significant size reduction and the stopband enhancement. To explain the prominent results, a dispersion analysis for the proposed MPP-EBG structure is developed. Compared to a mushroom-type EBG structure, it is experimentally demonstrated that the MPP-EBG structure presents a 57% reduction in the start frequency of the bandgap, which leads to a 74% reduction in a unit cell size. In addition, the MPP-EBG structure considerably improves the noise suppression bandwidth (-40 dB) from 0.8 to 4.9 GHz compared to the mushroom-type EBG structure.