In the present work, we report the fabrication, spectroscopic, and mechanical properties of the novel f-MWCNTS/g-C ₃ N ₄ /TiO ₂ (MGT-NCs) metal-free ternary nanocomposite reinforced denture base PMMA. The functionalised-MWCNTs were introduced into the graphitic carbon nitride (g-C ₃ N ₄ ) nanopowders (NPs). The obtained high porous f-MWCNTS/g-C ₃ N ₄ NPs were mixed with 10 wt% of TiO ₂ NPs previously hydrothermally synthesized. These prepared powders were characterized by XRD, FE-SEM, HR-TEM, FT-IR, and Raman spectroscopy to study the crystal structure and morphology. Using a mechanical blender 2 wt% of g-C ₃ N ₄ , MWCNT/g-C ₃ N ₄ , and MGT-NCs were sintered into PMMA heat-activated denture base polymer powder and mixed with monomer to fabricate the composites through heat curing. Three different varieties of composite specimens were prepared into flexural, impact, compression, and hardness testing standards. From the comparative assessment of results, it is found that novel MGT-NCs reinforced PMMA exhibited superior mechanical properties. The surface morphology of the fractured and compressed specimens was studied using the SEM analysis and found to have dimples and increased roughness compared to the pristine PMMA and g-C ₃ N ₄ , MWCNT/g-C ₃ N ₄ . Hence, the fabricated novel metal-free MGT-NCs can be used as a reinforcement material in PMMA denture bases to achieve a concurrent enhancement in both physical and mechanical properties.

This paper presents a straight-forward finite element approach for the quantification of electronic package thermal performance under uncertainty. The method makes use of high accuracy sensitivity calculations and a gradient-based minimization method. The approach was applied to the thermal analysis of a ball grid array (BGA) package under uncertainty to illustrate its capabilities. The effect of uncertainty in the heat source, heat transfer coefficient, ambient temperature, and thermal conductivities of the component materials on the probability of exceeding a specified average junction temperature at the die-heat-spreader interface was studied. In addition, the performance and accuracy of two different methods for computing the required sensitivities were compared. Results showed that the average junction temperature probability was more sensitive to some system parameters over others, providing crucial information for selecting the manufacturing tolerance of BGA package components. For parameters identified as especially sensitive, selecting components with tighter tolerances will reduce uncertainty and increase the overall reliability. And for less sensitive parameters, selecting larger tolerance could help reduce manufacturing costs.