In this paper, a new nanoscale metal Ti particle-reinforced Mg-3Al-1Zn matrix composite was successfully designed and prepared, which is mainly characterized by the fact that in addition to the “light” advantages of magnesium matrix composite, it also realizes bidirectional improvement of strength and ductility of the composite, and can be used as an alternative material for military light vehicle armor and individual armor. The SEM test shows that the nano-Ti particles are uniformly distributed at the grain boundary under the extruded state, which nails the grain boundary, inhibits the grain growth, and significantly refines the grain. XRD tests show that the addition of nano-Ti particles increases the crystallinity of the composite, which is consistent with the SEM test results. In addition, the EBSD test shows that the weakening of the texture of Ti/Mg-3Al-1Zn matrix composites and the increase in the starting probability of slip system are the main reasons for the improvement in ductility. Mechanical tests show that the yield strength, tensile strength, and elongation of the 0.5 wt% Ti/Mg-3Al-1Zn matrix composites exceed the peak values of ASTM B107/B107M-13 by 38.6%, 26.7%, and 20%, respectively.

The copper-clad magnesium composite wire with a diameter of 3.12 mm and good interface bonding was prepared by cold rotary swaging. The effects of cold rotary swaging and annealing temperature on microstructure and properties of the wire were studied by electron backscatter diffraction, transmission electron microscopy, as well as mechanical and electrical properties tests. The results show that the multi-pass cold rotary swaging composite has a great effect on grain refinement, microstructure recovery and structural unit reorientation, and can also make the wire obtain good interfacial bonding quality, improve mechanical properties, and the tensile strength can reach 289 MPa. The width of the interface layer widened with the increase of temperature, and the increase improved significantly at annealing temperatures of 450 °C and 500 °C, and the intermetallic compounds Mg₂Cu and MgCu₂ were found in the longitudinal section of the wire, respectively. After a reasonable annealing process of 400 °C/1 h, the interface layer did not thicken significantly, and the ductility and conductivity of the wire were the best, and the elongation after fracture and conductivity could reach 17% and 81.1% IACS, which increased by 15.2% and 3.8% compared with before annealing, respectively.