In this study, Ti-22Al-25Nb intermetallic compound alloys are fabricated through selective laser melting (SLM) at four scanning speeds (600, 700, 800, and 900 mm/s). The microstructure and mechanical properties of the selective laser melting fabricated alloys are systematically evaluated. The results indicate that scanning speed significantly affects microstructure characteristics (e.g., relative density, grain size, texture density, and the precipitation of secondary phases). The variation laws of the relative density, grain size, and texture density are likewise affected by scanning speed. The relative density, grain size, and texture density increase and then decrease with the increase in scanning speed. The alloy fabricated with the lowest scanning speed (600 mm/s) exhibits the maximum relative density, grain size, and texture density. By contrast, the alloy with the highest scanning speed (900 mm/s) exhibits the minimum relative density, grain size, and texture density. Furthermore, the precipitations of the O phase and Ti₃Al phase are primarily distributed in regions with a high strain concentration near the pool boundary. The alloy fabricated with a 600 mm/s scanning speed simultaneously achieves the highest strength and elongation, which is closely correlated with the uniform distribution of secondary phases.

Thermal conductivity is one of the most significant criterion of three-dimensional carbon fiber-reinforced SiC matrix composites (3D C/SiC). Represent volume element (RVE) models of microscale, void/matrix and mesoscale proposed in this work are used to simulate the thermal conductivity behaviors of the 3D C/SiC composites. An entirely new process is introduced to weave the preform with three-dimensional orthogonal architecture. The 3D steady-state analysis step is created for assessing the thermal conductivity behaviors of the composites by applying periodic temperature boundary conditions. Three RVE models of cuboid, hexagonal and fiber random distribution are respectively developed to comparatively study the influence of fiber package pattern on the thermal conductivities at the microscale. Besides, the effect of void morphology on the thermal conductivity of the matrix is analyzed by the void/matrix models. The prediction results at the mesoscale correspond closely to the experimental values. The effect of the porosities and fiber volume fractions on the thermal conductivities is also taken into consideration. The multi-scale models mentioned in this paper can be used to predict the thermal conductivity behaviors of other composites with complex structures.