High Power Impulse Magnetron Sputtering (HiPIMS) is a coating technology that combines magnetron sputtering with pulsed power concepts. By applying power in pulses of high amplitude and a relatively low duty cycle, large fractions of sputtered atoms and near-target gases are ionized. In contrast to conventional magnetron sputtering, HiPIMS is characterized by self-sputtering or repeated gas recycling for high and low sputter yield materials, respectively, and both for most intermediate materials. The dense plasma in front of the target has the dual function of sustaining the discharge and providing plasma-assistance to film growth, affecting the microstructure of growing films. Many technologically interesting thin films are compound films, which are composed of one or more metals and a reactive gas, most often oxygen or nitrogen. When reactive gas is added, non-trivial consequences arise for the system because the target may become “poisoned,” i.e., a compound layer forms on the target surface affecting the sputtering yield and the yield of secondary electron emission and thereby all other parameters. It is emphasized that the target state depends not only on the reactive gas' partial pressure (balanced via gas flow and pumping) but also on the ion flux to the target, which can be controlled by pulse parameters. This is a critical technological opportunity for reactive HiPIMS (R-HiPIMS). The scope of this tutorial is focused on plasma processes and mechanisms of operation and only briefly touches upon film properties. It introduces R-HiPIMS in a systematic, step-by-step approach by covering sputtering, magnetron sputtering, reactive magnetron sputtering, pulsed reactive magnetron sputtering, HiPIMS, and finally R-HiPIMS. The tutorial is concluded by considering variations of R-HiPIMS known as modulated pulsed power magnetron sputtering and deep-oscillation magnetron sputtering and combinations of R-HiPIMS with superimposed dc magnetron sputtering.

Because plasma production at vacuum cathode spots is approximately proportional to the arc current, arc current modulation can be used to generate ion current modulation that can be detected far from the spot using a negatively biased ion collector. The drift time to the ion detector can used to determine kinetic ion energies. A very wide range of cathode materials have been used. It has been found that the kinetic ion energy is higher at the beginning of each discharge and approximately constant after 150 μs. The kinetic energy is correlated with the arc voltage and the cohesive energy of the cathode material. The ion erosion rate is in inverse relation to the cohesive energy, enhancing the effect that the power input per plasma particle correlates with the cohesive energy of the cathode material. The influence of three magnetic field configurations on the kinetic energy has been investigated. Generally, a magnetic field increases the plasma impedance, arc burning voltage, and kinetic ion energy. However, if the plasma is produced in a region of low field strength and streaming into a region of higher field strength, the velocity may decrease due to the magnetic mirror effect. A magnetic field can increase the plasma temperature but may reduce the density gradients by preventing free expansion into the vacuum. Therefore, depending on the configuration, a magnetic field may increase or decrease the kinetic energy of ions.

The commonly used current-voltage characteristics are found inadequate for describing the pulsed nature of the high power impulse magnetron sputtering (HIPIMS) discharge; rather, the description needs to be expanded to current-voltage-time characteristics for each initial gas pressure. Using different target materials (Cu, Ti, Nb, C, W, Al, and Cr) and a pulsed constant-voltage supply, it is shown that the HIPIMS discharges typically exhibit an initial pressure dependent current peak followed by a second phase that is power and material dependent. This suggests that the initial phase of a HIPIMS discharge pulse is dominated by gas ions, whereas the later phase has a strong contribution from self-sputtering. For some materials, the discharge switches into a mode of sustained self-sputtering. The very large differences between materials cannot be ascribed to the different sputter yields but they indicate that generation and trapping of secondary electrons play a major role for current-voltage-time characteristics. In particular, it is argued that the sustained self-sputtering phase is associated with the generation of multiply charged ions because only they can cause potential emission of secondary electrons, whereas the yield caused by singly charged metal ions is negligibly small.