Kim S. Siow is a research fellow/associate professor at the Institute of Microengineering and Nanoelectronics, National University of Malaysia (UKM). His multidisciplinary research interests are related to plasma surface modification, sintered silver bonding and patent circumvention. Before joining UKM, he worked as a materials engineer in multinational companies and at the National University of Singapore, and as a technology transfer officer at the commercialization arm of Singapore A*STAR research institutes.