This study investigates the stress corrosion cracking (SCC) behavior of type 316L stainless steel (SS316L) produced with sinter-based material extrusion additive manufacturing (AM). Sinter-based material extrusion AM produces SS316L with microstructures and mechanical properties comparable to its wrought counterpart in the annealed condition. However, despite extensive research on SCC of SS316L, little is known about the SCC of sinter-based AM SS316L. This study focuses on the influence of sintered microstructures on SCC initiation and crack-branching susceptibility. Custom-made C-rings were exposed to different stress levels in acidic chloride solutions at various temperatures. Solution-annealed (SA) and cold-drawn (CD) wrought SS316L were also tested to understand the SCC behavior of SS316L better. Results showed that sinter-based AM SS316L was more susceptible to SCC initiation than SA wrought SS316L but more resistant than CD wrought SS316L, as determined by the crack initiation time. Sinter-based AM SS316L showed a noticeably lower tendency for crack-branching than both wrought SS316L counterparts. The investigation was supported by comprehensive pre- and post-test microanalysis using light optical microscopy, scanning electron microscopy, electron backscatter diffraction, and micro-computed tomography.

Austenitic stainless steel UNS S31603 (SS316L) is widely used in the resources industry due to its excellent corrosion resistance, ductility, and weldability. Recently, laser-based powder bed fusion (LPBF) manufacturing has gained popularity for creating SS316L components with complex geometries and superior mechanical properties. However, the rapid melting and solidification of the deposited layers during the thermal cycle of LPBF produce residual stresses. Components manufactured through LPBF are frequently used under applied stress in corrosive environments. Thus, it is crucial to understand their susceptibility to stress corrosion cracking (SCC) and the impact of residual stresses. This study investigated the combined effects of applied stress and temperature on the SCC behavior of LPBF SS316L using custom-made C-ring test specimens. Cold-drawn wrought SS316L was included for comparison. Stress relief heat treatment, microhardness testing, partial immersion testing, and microanalysis techniques, such as light optical microscopy, scanning electron microscopy, and electron backsacttered diffraction were used to quantify the SCC behavior. The outcomes of this study showed that stressed and unstressed LPBF SS316L specimens were highly susceptible to cracking around their printed holes. The SCC susceptibility was attributed to the residual stresses introduced by the printed supports, as both polished and as-printed holes showed similar cracking behavior. This work provides valuable insights and lays a foundation for further research into the impact of using C ring samples to investigate SCC susceptibility and sheds light on the SCC susceptibility of as-printed components of complex geometry printed with supports due to the influence of residual stresses.

There is a fast-growing interest in the use of selective laser melting (SLM) for metal/alloy additive manufacturing. Our current knowledge of SLM-printed 316 stainless steel (SS316) is limited and sometimes appears sporadic, presumably due to the complex interdependent effects of a large number of process variables of the SLM processing. This is reflected in the discrepant findings in the crystallographic textures and microstructures in this investigation compared to those reported in the literature, which also vary among themselves. The as-printed material is macroscopically asymmetric in terms of both structure and crystallographic texture. The and crystallographic directions align parallel with the SLM scanning direction (SD) and build direction (BD), respectively. Likewise, some characteristic low-angle boundary features have been reported to be crystallographic, while this investigation unequivocally proves them to be non-crystallographic, since they always maintain an identical alignment with the SLM laser scanning direction, irrespective of the matrix material’s crystal orientation. There are also 500 ± 200 nm columnar or cellular features, depending on the cross-section, which are generally found all over the sample. These columnar or cellular features are formed with walls made of dense packing of dislocations entangled with Mn-, Si- and O-enriched amorphous inclusions. They remain stable after ASM solution treatments at a temperature of 1050 °C, and therefore, are capable of hindering boundary migration events of recrystallization and grain growth. Thus, the nanoscale structures can be retained at high temperatures. Large 2–4 μm inclusions form during the solution treatment, within which the chemical and phase distribution are heterogeneous.

This study investigates the stress corrosion cracking (SCC) behavior of type 316L stainless steel (SS316L) produced with sinter-based material extrusion additive manufacturing (AM). This technology has been shown to produce SS316L with microstructures and mechanical properties comparable to its wrought counterpart in the annealed condition. However, despite plenty of research on SCC of SS316L, little is known about SCC in sinter-based AM SS316L. This study focuses on the influence of sintered microstructures on susceptibility to SCC initiation and crack-branching. Custom-made C-rings were exposed to different stress levels in acidic chloride solutions at various temperatures. To better understand the SCC behavior of SS316L, solution-annealed (SA) and cold-drawn (CD) wrought SS316L were tested for comparison. Results showed that sinter-based AM SS316L was more susceptible to SCC initiation than SA wrought SS316L but more resistant than CD wrought SS316L. Moreover, sinter-based AM SS316L showed noticeably better resistance to crack-branching than both wrought SS316L counterparts. The investigation was supported by comprehensive pre- and post-test microanalysis using light optical microscopy (LOM), scanning electron microscopy (SEM), electron backscatter diffraction (EBSD), and micro-computed tomography (micro-CT)