We investigate the impact of threading dislocation density on the reliability of 1.3 μm InAs quantum dot lasers epitaxially grown on Si. A reduction in the threading dislocation density from 2.8 × 10⁸ cm⁻² to 7.3 × 10⁶ cm⁻² has improved the laser lifetime by about five orders of magnitude when aged continuous-wave near room temperature (35 °C). We have achieved extrapolated lifetimes (time to double initial threshold) more than 10 × 10⁶ h. An accelerated laser aging test at an elevated temperature (60 °C) reveals that p-modulation doped quantum dot lasers on Si retain superior reliability over unintentionally doped ones. These results suggest that epitaxially grown quantum dot lasers could be a viable approach to realize a reliable, scalable, and efficient light source on Si.

Monolithic integration of quantum dot (QD) gain materials onto Si photonic platforms via direct epitaxial growth is a promising solution for on-chip light sources. Recent developments have demonstrated superior device reliability in blanket hetero-epitaxy of III–V devices on Si at elevated temperatures. Yet, thick, defect management epi designs prevent vertical light coupling from the gain region to the Si-on-Insulator waveguides. Here, we demonstrate the first electrically pumped QD lasers grown by molecular beam epitaxy on a 300 mm patterned (001) Si wafer with a butt-coupled configuration. Unique growth and fabrication challenges imposed by the template architecture have been resolved, contributing to continuous wave lasing to 60 °C and a maximum double-side output power of 126.6 mW at 20 °C with a double-side wall-plug efficiency of 8.6%. The potential for robust on-chip laser operation and efficient low-loss light coupling to Si photonic circuits makes this heteroepitaxial integration platform on Si promising for scalable and low-cost mass production.

We report for the first time the direct growth of quantum dot (QD) lasers with electrical pumping on 300 mm Si wafers on both a planar template and in-pocket template for in-plane photonic integration. O-band lasers with five QD layers were grown with molecular beam epitaxy (MBE) in a 300 mm reactor and then fabricated into standard Fabry–Perot ridge waveguide cavities. Edge-emitting lasers are demonstrated with high yield and reliable results ready for commercialization and scaled production, and efforts to make monolithically integrated lasing cavities grown on silicon-on-insulator (SOI) wafers vertically aligned and coupled to SiN waveguides on the same chip show the potential for 300 mm-scale Si photonic integration with in-pocket direct MBE growth.

Monolithically integrated lasers on silicon photonics enable scalable, foundry-compatible production for data communications applications. However, material mismatches in heteroepitaxial systems and high coupling losses pose challenges for III-V integration on silicon. We combine three techniques: recessed silicon pockets for III-V growth, two-step heteroepitaxy using both MOCVD and MBE, and a polymer facet gap-fill approach to develop O-band InAs quantum dot lasers monolithically integrated on silicon photonics chiplets. Lasers coupled to silicon ring resonators and silicon nitride distributed Bragg reflectors (DBR) demonstrate single-mode lasing with side-mode suppression ratio up to 32 dB. Devices lase at temperatures up to 105 °C with an extrapolated operational lifetime of 6.2 years at 35 °C.

Quantum dot (QD) lasers epitaxially grown on Si have already been demonstrated to show record low threshold, high temperature tolerance, and low feedback sensitivity. When grown on the silicon photonic chip and integrated with Si waveguides (WGs), QD lasers offer considerable economical and foundry‐scalable solutions to on‐chip light sources. Yet, a technology that enables both growth and integration of QD lasers on a silicon photonic chip has not been demonstrated. Herein, a novel device platform which enables integration of the QD active region with passive WG structures is designed. By doing so, complex and high‐performance lasers such as distributed Bragg reflector lasers, mode‐locked lasers, and sampled grating distributed Bragg reflector tunable lasers are demonstrated in this platform. The same laser epitaxial stack can be easily grown on the substrate of a silicon photonic chip to allow light coupling from QD laser cavities to the silicon WGs.

The direct growth of III-V lasers on silicon has the potential to allow for low-cost production of silicon photonic integrated circuits on a 300 mm wafer-scale. However, coupling loss severely limits the performance in current implementations of direct growth processes due to the growth of undesirable polycrystalline material on silicon dioxide sidewalls. In this work, we report the use of selective area molecular beam epitaxy growth to reduce the formation of this polycrystalline material during the growth process and improve the coupling efficiency. Furthermore, we demonstrate electrically pumped continuous wave lasers directly grown on foundry-fabricated silicon photonic integrated circuit wafers using this technique.