High‐voltage direct current (HVDC) and high‐voltage alternating current (HVAC) cables are the most important equipment for high‐voltage, large‐capacity and long‐distance power transmission. Electrical tree is a pre‐breakdown phenomenon leading to failure of insulation materials, and it is the major issue that threatens the safe and stable operation of HVDC and HVAC cable systems. This study summarises and analyses the achievements in the research of electrical tree for HVDC and HVAC cables. The initiation mechanisms of the electrical tree, including Maxwell electro‐mechanical stress, charge injection–extraction, charge trapping and electroluminescence theories, are elaborated for fully understanding the electrical degradation process in insulation materials. Then, the influences of the high electric field, high temperature and mechanical stress on electrical tree behaviours are discussed, and the relationship between charge transport and the electrical tree is analysed and illustrated. The suppression methods of the electrical tree are put forward by introducing inorganic and organic additives into insulation materials, and the suppression mechanisms are presented from the viewpoints of the structure‐property and microscale–macroscale relationships. Recently, the electrical tree research studies are focused on the high‐precision of initiation models, high‐dependence of multi‐physical fields and high‐efficiency of suppression methods. The achievements provide theoretical support for improving the electrical performance of insulation materials, while it is a practical problem to explore their application feasibility in HVDC and HVAC cable.

The electric field distributions along gas‐solid interfaces determine the reliability, lifetimes and sizes of gaseous insulated switchgears/pipelines (GIS/GIL), which also affect the reliability of power systems. In this study, the characteristics of steady and transient electric field distributions were first introduced, followed by the concept of functionally graded materials (FGMs). The development histories of FGM applied in electrical engineering and the related optimisation methods were described in detail. The field regulation effect and fabrication technology of different FGM insulators were also compared. To overcome the limitations of traditional FGM insulators, the design of surface FGM (SFGM) was proposed, together with their preparation methods and electrical performance. Furthermore, the future development prospects of FGM and SFGM insulators for compact GIS/GIL were summarised.

Polypropylene (PP) has been paid much attention due to its high melting point, excellent electrical insulting performance and thermoplastic property, which is potential to replace the XLPE as HVDC cable insulating material. Blending PP with polyolefin elastomer (POE) is an effective way to modify its stiffness and brittleness at room temperature. However, space charge behavior of PP/POE blend, as a great concern under dc stress, is not clear and needs further investigation. To research the space charge behaviors, pure PP, PP/POE blend and its nanocomposites with different contents were prepared. Then, mechanical properties, permittivity constant, breakdown strength, volume resistivity, space charge behaviors and trap level distribution were investigated. The results indicate the addition of POE enhances the mechanical flexibility of PP greatly, and nano-sized ZnO doping has little effect on the mechanical flexibility of PP/POE blend. The nanocomposites show lower permittivity constant, higher breakdown strength and higher volume resistivity than the PP/POE blend. Compared to pure PP, the space charge accumulation and electric field distortion get severe in PP/POE blend. However, by nanoparticles doping, space charges are remarkably suppressed, which is related to the increased trap level density in nanocomposites. It indicates the PP/POE/ZnO nanocomposites have much potential for HVDC cable application, which show high mechanical flexibility as well as excellent electrical performance.

Anhydride-cured bisphenol-A epoxy resin is widely used in the support, insulation and sealing key components of electrical and electronic equipment due to their excellent comprehensive performance. However, overheating and breakdown faults of epoxy resin-based insulation occur frequently under conditions of large current carrying and multiple voltage waveforms, which seriously threaten the safe and stable operation of the system. The curing regime, including mixture ratio and combination of curing time and temperature, is an important factor to determine the microstructure of epoxy resin, and also directly affects its macro performances. In this paper, the evolution of curing kinetic models of anhydride-cured epoxy resin was introduced to determine the primary curing regime. The influences of curing regime on the insulation performance were reviewed considering various mixture ratios and combinations of curing time and temperature. The curing regime-dependent microstructure was discussed and attributed to the mechanisms of insulation performance.

Interface charges are easy to accumulate between two different dielectrics with various characteristics, which may cause accelerated degradation of insulation systems. Ethylene-propylene-diene terpolymer (EPDM) is used mainly for HVDC cable joint, which is the most vulnerable part of the cable system because of the interface. Particles with nonlinear conductivity can be doped into the polymer matrix to modify the interface charge behaviors through altering the conductivity under combined stresses. In this paper, silicon carbide (SiC) particles were dispersed into EPDM with 0, 10, 30 and 50 wt% respectively. The space charge behaviors at the interface between LDPE and EPDM filled with SiC particles was measured under 15 and 30 kV/mm. Besides, dielectric constant, dc conduction and trap distribution were introduced to elaborate the suppression mechanism with SiC doping. The SEM results show that the particles are well distributed in the EPDM. The permittivity increases with the fillgrade and the dc conductivity shows an obvious nonlinear trend under various electrical fields. SiC doping can effectively suppress the interface charge accumulation under different stresses. The suppression mechanism is attributed to the nonlinear conductivity and more shallow traps of EPDM/SiC composite. As a consequence, the approximate SiC doped EPDM can availably suppress the interface charge accumulation and offers a possible method for the improvement of cable accessory performance.

GIS spacers made of epoxy resin always suffer from the flashover due to surface charge accumulation. Therefore, it is important to seek a new method to improve the performance of epoxy resin. The epoxy/SiC composites have been proven to have nonlinear conductivity and the potential of being used in the spacer manufacture because of their field grading function under DC voltage. A high temperature rise on the central conductor of GIS can cause a large temperature gradient along the spacers. Exploring the effects of temperature on the electrical properties of the epoxy/SiC composites is helpful in the design the space dependent SiC filler content in GIS spacers. In this paper, three temperatures 20, 50 and 70 °C were studed on the temperature dependent surface potential decay (SPD) and flashover characteristics of the epoxy/SiC composites. At 20 °C, the epoxy/SiC composites, especially the 14 vol % samples, have much better SPD performances and higher flashover voltages than the pure epoxy. As the temperature increases, the SPD performances of all samples are greatly improved. The SPD rate of the 0 vol % samples approaches that of the 6 vol % samples at 50 °C and the 14 vol % samples at 70 °C. When the temperature is over 50 °C, flashover of the epoxy/SiC composites occur at lower voltages compared with the pure epoxy resin. With a further increase of temperature from 50 to 70°C, the flashover voltages of all samples have a significant drop, indicating that the temperature effects on flashover fault must be included in the spacer design and manufacture.