Advancement of technologies has resulted in the innovation new engineering materials which are very difficult to machine with conventional machining process. To produce intricate features in these materials with conventional machining process will result in poor surface finish and will require thousands of slide movements. So new non-conventional machining process are introduced to machine difficult to machine materials. Electro Discharge Machining (EDM) and Electro Chemical Machining (ECM) are introduced to meet the needs of industry to machine conducting materials. But for non-conducting materials, a hybrid process combining the features of many conventional and non conventional machining process are required. Electro Chemical Discharge Machining (ECDM) is one such innovative non-conventional hybrid process, which can machine the conductive as well as non conductive engineering materials. In present research work, the effect of process parameters of ECDM on Material Removal Rate (MRR) is studied on borosilicate glass. The design of experiments is used for experimental layout plan for the conduction of experiments. As MRR is found to be non linear, Response Surface Modeling (RSM) is used for optimization of process parameters. The obtained results are validated with experimental results

Semi conducting materials like silicon, germanium, tellurium are in high demand in Micro Electro Mechanical Systems (MEMS) applications like lab-on-chip devices, micro sensors, micro pumps.etc. Micro machining of the silicon for various applications in MEMS is tedious and time consuming. Electro Chemical Discharge Machining (ECDM) process is an advanced hybrid process used to machine electrically conducting as well as non-conducting materials. In the present paper, an attempt has been made to machine silicon wafer of 500 micrometer thickness using stainless steel wire. Characterization of micro holes has been reported mainly in terms of material removal rate, radius of overcut and heat affected zone. The machining parameters are optimized using multi response analysis - Grey Relation Method. The detailed results are presented in the paper

Electro Chemical Discharge Machining (ECDM) is a hybrid non-conventional manufacturing process which combines the features of Electro Chemical Machining (ECM) and Electro Discharge Machining (EDM). This process is important since it can machine a variety of materials including non-conducting materials like ceramics, composites, alumina, glass, etc. This paper attempts to develop a thermal model of ECDM process for determining the Material Removal Rate (MRR) with direct current (DC) and pulse DC.Comparing both DC and pulse DC on the bases of temperature variations and material removal rate, pulse DC is found to be better than DC with lower temperature range and higher MRR

Micromachining techniques has increased the demand for precise and accurate instruments which are used in many industries. Glass materials offer higher challenges in micro machining as they are tough, non-conducting and difficult to machine with conventional machining operations. Electro Chemical Discharge Machining (ECDM) is a new non-conventional hybrid machining process which combines the features of Electrical Discharge Machining (EDM) and Electro Chemical Machining (ECM) to machine both conducting and nonconducting materials. In the present paper effect of various process parameters like voltage, concentration of electrolyte, duty factor and temperature on ECDM process are studied to obtain desired micro channels in soda lime glass. Design of Experiment (DOE) is used to plan and conduct the experiments. The Response Surface Modelling (RSM) is used for characterising non linear output responses in terms of material removal rate and surface finish. Modeled results are validated with experimental values.

In today's hi-tech engineering world, a lot of engineering materials are being developed for applications in nuclear industry, automotive industry, aerospace industries, etc. These engineering materials are hard, high strength-to-weight ratio, heat resistant and very difficult to machine using conventional machining techniques. So non-conventional machining techniques gain importance in these fields. Electro chemical discharge machining (ECDM) is one such innovative non-conventional hybrid process, which is used to machine the electrically conductive and non-conductive engineering materials. In present research paper, an innovative study has been made to understand the effect of process parameters of ECDM on material removal rate (MRR) and heat affected zone (HAZ) while machining a silicon wafer. The design of experiments is used for experimental layout plan and for the conduction of experiments. The MRR is found to be non-linear behaviour due to many process parameters like voltage, concentration, duty factor, etc. So response surface modelling (RSM) is used for studying the effect of two parameters simultaneously on MRR. The results are validated with obtained experimental results.