Erol Sancaktar

Prof. Erol Sancaktar

Department of Polymer Engineering, University of Akron, Akron, OH, 44325-0301 USA
orcid

Research Focus & Metrics

Academic Career Length

47Years (1980-Present)

(Calculated once Scilit publication data is synced: current year − year of first publication + 1)

Representative Publications

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22 June 2003 in Nature Materials
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Journal Article
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SLSergei F. Lyuksyutov
Sergei F. Lyuksyutov
RVRichard A. Vaia
Richard A. Vaia
PPPavel B. Paramonov
Pavel B. Paramonov
SJShane Juhl
Shane Juhl
LWLynn Waterhouse
Lynn Waterhouse
Erol SancaktarErol Sancaktar
Erol Sancaktar

1 January 2000 in Journal of Adhesion Science and Technology
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Journal Article
Closed access
Erol SancaktarErol Sancaktar
Erol Sancaktar
SKSumeet Kumar
Sumeet Kumar
This paper introduces a novel approach to increasing the lap joint strength, different from the traditional methods of either increasing the lap joint area or altering the joint geometry. This is a...

1 April 2013 in Composites Part A: Applied Science and Manufacturing
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Journal Article
Closed access
JBJun Bian
Jun Bian
HLHai Lan Lin
Hai Lan Lin
FHFei Xiong He
Fei Xiong He
XWXiao Wei Wei
Xiao Wei Wei
ICI-Ta Chang
I-Ta Chang
Erol SancaktarErol Sancaktar
Erol Sancaktar

10 February 2011 in Polymers
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Journal Article
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Erol SancaktarErol Sancaktar
Erol Sancaktar
LBLan Bai
Lan Bai
Conductive adhesives are widely used in electronic packaging applications such as die attachment and solderless interconnections, component repair, display interconnections, and heat dissipation. The effects of film thickness as functions of filler volume fraction, conductive filler size, shape, as well as uncured adhesive matrix viscosity on the electrical conduction behavior of epoxy-based adhesives are presented in this work. For this purpose, epoxy-based adhesives were prepared using conductive fillers of different size, shape, and types, including Ni powder, flakes, and filaments, Ag powder, and Cu powder. The filaments were 20 μm in diameter, and 160 or 260 μm in length. HCl and H3PO4 acid solutions were used to etch and remove the surface oxide layers from the fillers. The plane resistance of filled adhesive films was measured using the four-point method. In all cases of conductive filler addition, the planar resistivity levels for the composite adhesive films increased when the film thickness was reduced. The shape of resistivity-thickness curves was negative exponential decaying type and was modeled using a mathematical relation. The relationships between the conductive film resistivities and the filler volume fractions were also derived mathematically based on the experimental data. Thus, the effects of surface treatment of filler particles, the type, size, shape of fillers, and the uncured epoxy viscosity could be included empirically by using these mathematical relations based on the experimental data. By utilizing the relations we proposed to model thickness-dependent and volume fraction-dependent conduction behaviors separately, we were able to describe the combined and coupled volume fraction-film thickness relationship mathematically based on our experimental data.

23 January 2023 in Industrial & Engineering Chemistry Research
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Journal Article
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Jomin ThomasJomin Thomas
Jomin Thomas
Erol SancaktarErol Sancaktar
Erol Sancaktar

1 January 2001 in Journal of Adhesion Science and Technology
Verified
Journal Article
Closed access
Erol SancaktarErol Sancaktar
Erol Sancaktar
RGRajesh Gomatam
Rajesh Gomatam
In order to gain an insight into the aspects of surface roughness, surface profile, adhesive viscosity, and surface morphology, experiments were conducted using two different steels (1018 cold-roll...