Micro-optical elements and complex optical microsystems require ultraprecise manufacturing processes. The maximum tolerable roughness is defined by fractions of the used wavelength $\lambda$, e.g., $\frac{\lambda }{100}$ or better, whereas the overall size and shape of the elements can easily reach the millimeter or centimeter range. Next to the industrially established ion beam polishing approaches for optical surfaces with ultra low surface roughness, reactive ion etching (RIE) has been demonstrated for the efficient realization of highly precise microstructured optical surfaces for beam-shaping^1,2 and beam-splitting,³ as well as for imaging⁴ and illumination^5,6 applications. During RIE, material transport is achieved by a combination of physical and chemical (reactive) interaction of ions and reactive gases with the surface in a plasma reactor. The chemical fraction of the process is naturally highly dependent on the substrate/precursor gas composition. Thus, the process has been developed for the semiconductor industry and is well-established and successfully applied for microstructuring of pure materials (e.g., semiconducting alloys such as GaAs, GaN, and others or Si)⁷ as well as pure fused silica (FS) substrates for optical purposes.⁸ Also polymers can be etched in a reactive plasma based on oxygen and in combination with other gases (if required).⁹ Significant advantages are provided as plasma etching does not necessarily require high process temperatures, while the energy of the individual etching species can be very high. This decoupling of temperature and energy is a significant advantage of plasma enhanced etching processes against purely chemical etching in which the activation energy is applied by temperature only. On the other hand, numerous effects influence the local material removal rate, so defined etching profiles require a detailed knowledge of the etching process.

Ultralow expansion (ULE) glasses are of special interest for temperature stabilized systems for example in precision metrology. Nowadays, ULE materials are mainly used in macroscopic and less in micromechanical systems. Reasons for this are a lack of technologies for parallel fabricating high‐quality released microstructures with a high accuracy. As a result, there is a high demand in transferring these materials into miniaturized application examples, realistic system modeling, and the investigation of microscopic material properties. Herein, a technological base for fabricating released micromechanical structures and systems with a structure height above 100 μm in ULE 7972 glass is established. Herein, the main fabrication parameters that are important for the system design and contribute thus to the introduction of titanium silicate as material for glass‐based micromechanical systems are discussed. To study the mechanical properties in combination with respective simulation models, microcantilevers are used as basic mechanical elements to evaluate technological parameters and other impact factors. The implemented models allow to predict the micromechanical system properties with a deviation of only ±5% and can thus effectively support the micromechanical system design in an early stage of development.

Photosensitive glasses for radiation-induced 3D microstructuring, due to their optical transparency and thermal, mechanical, and chemical resistance, enable the use of new strategies for numerous microscale applications, ranging from optics to biomedical systems. In this context, we investigated the plasma etching of photosensitive glasses after their exposure and compared it to the established wet chemical etching method, which offers new degrees of freedom in microstructuring control and microsystem fabrication. A CF₄/H₂ etching gas mixture with a constant volumetric flow of 30 sccm and a variable H₂ concentration from 0% to 40% was utilized for plasma-based etching, while for wet chemical etching, diluted hydrofluoric acid (1% ≤ c_HF ≤ 20%) was used. Therefore, both etching processes are based on a chemical etching attack involving fluorine ions. A key result is the observed reversion of the etch selectivity between the initial glassy and partially crystallized parts that evolve after UV exposure and thermal treatment. The crystallized parts were found to be 27 times more soluble than the unexposed glass parts during wet chemical etching. During the plasma etching process, the glassy components dissolve approximately 2.5 times faster than the partially crystalline components. Unlike wet chemical etching, the surfaces of plasma etched photostructured samples showed cone- and truncated-cone-shaped topographies, which supposedly resulted from self-masking effects during plasma etching, as well as a distinct physical contribution from the plasma etching process. The influences of various water species on the etching behaviors of the homogeneous glass and partially crystallized material are discussed based on FTIR-ATR and in relation to the respective etch rates and SNMS measurements.

Deep etching of glass and glass ceramics is far more challenging than silicon etching. For thermally insensitive microelectromechanical and microoptical systems, zero‐expansion materials such as Zerodur or ultralow expansion (ULE) glass are intriguing. In contrast to Zerodur that exhibits a complex glass network composition, ULE glass consists of only two components, namely, TiO₂ and SiO₂. This fact is highly beneficial for plasma etching. Herein, a deep fluorine‐based etching process for ULE 7972 glass is shown for the first time that yields an etch rate of up to 425 nm min⁻¹ while still achieving vertical sidewall angles of 87°. The process offers a selectivity of almost 20 with respect to a nickel hard mask and is overall comparable with fused silica. The chemical surface composition is additionally investigated to elucidate the etching process and the impact of the tool configuration in comparison with previously published etching results achieved in Zerodur. Therefore, deep and narrow trenches can be etched in ULE glass with high anisotropy, which supports a prospective implementation of ULE glass microstructures, for instance, in metrology and miniaturized precision applications.

A new disposable radio-frequency identification (RFID) sensor for detecting oxygen in packages with a protective atmosphere is presented. For safety reasons and system costs in consumer packages, no battery or energy harvesting devices can be used. Each part of a package, especially in food packaging, must be completely safe even if it is swallowed. Several materials have been investigated that safely react with oxygen and thus change electrical parameters without the need of an additional energy supply. In particular linseed oil was tested, because it is known to react in oxygen-containing atmosphere from liquid to solid. Linseed oil is used not only as food but also as a key part in ecological paint coatings. A significant relative change of capacity was observed during linseed oil drying, which results in −20% after 5 h and −38% after 30 h at an oxygen concentration of 20.5 and 50% relative humidity, respectively. Pure unsaturated fatty acids were also tested in an oxygen-containing atmosphere and showed similar behaviour. The reaction speed is partially dependent on the level of unsaturation of fatty acids. The oxygen sensor is coupled with an RFID front end with an internal charge time measurement unit for capacity determination. The combination of sensor element, sensitive material and RFID allows for biocompatible and save systems that indicate the presence of oxygen within a package.