Normally off AlGaN/GaN high electron mobility transistors (HEMTs) with p-type gates are attracting increasing attention due to their high safety and low power loss in the field of power switching. In this work, to solve the Mg difficult activating problem of the conventional p-GaN gate AlGaN/GaN HEMTs, we propose an advanced design for the normally off AlGaN/GaN HEMT with a p-type hexagonal boron nitride (h-BN) gate cap layer to effectively manipulate the channel transport of the device. The simulation results demonstrate that the p-hBN gate cap HEMTs yield superior performance over conventional p-GaN gate HEMTs in terms of output current and breakdown voltage, which can be attributed to the deeper potential well formation at the AlGaN/GaN interface and more accumulation of holes located at the p-hBN/AlGaN interface. Moreover, we investigate the effect of bandgap variation on device performance, taking into account that the exact bandgap of h-BN remains under debate. Herein, valuable insights into h-BN cap-gate E-mode AlGaN/GaN HEMT devices are provided, which could serve as a useful reference for the future development of robust III-nitride material power electronic devices.

Radiation-hardened semiconductor GaN has drawn considerable attention owing to its excellent properties such as large displacement energy. Many studies have focused on evaluating the degradation of GaN-based power device performance by proton beam or particle irradiation, while quantitative analysis of the energy transfer process of particles inside the material and the mechanisms involved in inducing degradation of electrical properties are rare. Here, on the basis of the fabricated alpha-particle detector, a device model validated by basic electrical experiments is established to simulate the influence of alpha-particle irradiation on the leakage current of the device. We observe that the current does not change significantly with increasing radiation fluence at low bias, while it shows a descending trend with increasing radiation fluence at higher bias. However, increasing the energy of the radiation particles at the same radiation fluence directly leads to a monotonically elevated leakage current. Such a series of phenomena is associated with radiation-induced changes in the density of trapped states within the active layers of the device.

This work presents a novel enhancement-mode hybrid p-type gate AlGaN/GaN high electron mobility transistor (HEMT) with a double barrier structure. The double barrier hybrid-gate (DBHG) HEMT yields better performance than the traditional p-GaN gate HEMTs in terms of threshold voltage and breakdown voltage, which can be attributed to the regulation of the interface electric field in the AlGaN barrier layers. Moreover, the simulated results indicate that the DBHG HEMT exhibits a high threshold voltage of 1.8 V and a breakdown voltage of 995 V. In addition, we discussed the influence of the thickness of each layer in the double barrier layer structure on device performance. This work provides valuable insights for future innovations in the structure design of HEMTs.