Shaoke Wan

Dr. Shaoke Wan


Research Focus & Metrics

Academic Career Length

7Years (2020-Present)

(Calculated once Scilit publication data is synced: current year − year of first publication + 1)

Representative Publications

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21 April 2023 in IEEE Transactions on Instrumentation and Measurement
Verified
Journal Article
Closed access
Shaoke WanShaoke Wan
Shaoke Wan
TLTianqi Li
Tianqi Li
BFBin Fang
Bin Fang
KYKe Yan
Ke Yan
JHJun Hong
Jun Hong
Xiaohu LiXiaohu Li
Xiaohu Li
The effective fault diagnosis of bearing can guarantee the safety of rotating machinery and is very important for its stable operation. The information fusion of multi-sensor data has been a feasible method to enhance the performance of fault diagnosis. However, how to fuse the joint information from different channels or even different kinds of sensors is still an important challenge. The present study proposes a novel multi-sensor information coupling network (MICN) for bearing fault diagnosis, which handles the signals from the same or different types of sensors, and the deeper features can be extracted from multi-sensors independently and simultaneously fused layer by layer. Especially, during the multi-layer feature fusion process, a novel feature-level information coupling model is developed based on the mutual attention mechanism. Finally, to validate the efficiency of the proposed method, several different experiments are designed, and the results show validity and superiority.

22 October 2020 in The International Journal of Advanced Manufacturing Technology
Verified
Journal Article
Closed access
PDF file
XLXiaohu Li
Xiaohu Li
Shaoke WanShaoke Wan
Shaoke Wan
XHXiaoWei Huang
XiaoWei Huang
JHJun Hong
Jun Hong

27 October 2020 in The International Journal of Advanced Manufacturing Technology
Verified
Journal Article
Closed access
PDF file
XLXiaohu Li
Xiaohu Li
SLShijie Liu
Shijie Liu
Shaoke WanShaoke Wan
Shaoke Wan
JHJun Hong
Jun Hong

22 June 2024 in Precision Engineering
Verified
Journal Article
Closed access
ZZZiquan Zhan
Ziquan Zhan
BFBin Fang
Bin Fang
Shaoke WanShaoke Wan
Shaoke Wan
YBYu Bai
Yu Bai
JHJun Hong
Jun Hong
Xiaohu LiXiaohu Li
Xiaohu Li

23 June 2021 in The International Journal of Advanced Manufacturing Technology
Verified
Journal Article
Closed access
PDF file
KJKang Jia
Kang Jia
JGJunkang Guo
Junkang Guo
TMTao Ma
Tao Ma
Shaoke WanShaoke Wan
Shaoke Wan

12 July 2021 in The Journal of Adhesion
Verified
Journal Article
Closed access
QLQiyin Lin
Qiyin Lin
YZYuhan Zhang
Yuhan Zhang
TYTing Yue
Ting Yue
Shaoke WanShaoke Wan
Shaoke Wan
JHJun Hong
Jun Hong
Considering the elastoplastic deformation of a single-crystal copper substrate, based on the atomic scale, a mixed potential function (EAM and Morse) and the Verlet algorithm were used to simulate the adhesion contact and separation process between a hemispherical diamond indenter and a single-crystal copper substrate at low temperatures. The influences of the temperature on the micro/nanomechanical properties of the material surface and on the mechanism of the subsurface deformation process were analysed. The results show that as the simulated temperature decreases, the time for adhesion to occur is delayed, and the adhesion forces increase slightly. While the indenter is being pressed, the temperature affects the generation and interaction of the dislocations in the substrate. As the temperature decreases, a large number of dislocations in the substrate are generated and then relatively reduced, and the load on the indenter fluctuates. A calculation of the mechanical properties of the material found that the contact stiffness was related to the elastic recovery energy. A smaller elastic recovery energy leads to a greater contact stiffness; thus, the indentation hardness is related to the plastic deformation energy. An increased plastic deformation energy results in a decreased indentation hardness.