Heterogeneous systems-on-chip (SoCs) are highly favorable computing platforms due to their superior performance and energy efficiency potential compared to homogeneous architectures. They can be further tailored to a specific domain of applications by incorporating processing elements (PEs) that accelerate frequently used kernels in these applications. However, this potential is contingent upon optimizing the SoC for the target domain and utilizing its resources effectively at run-time. To this end, system-level design - including scheduling, power-thermal management algorithms and design space exploration studies - plays a crucial role. This paper presents a system-level domain-specific SoC simulation (DS3) framework to address this need. DS3 enables both design space exploration and dynamic resource management for power-performance optimization of domain applications. We showcase DS3 using six real-world applications from wireless communications and radar processing domain. DS3, as well as the reference applications, is shared as open-source software to stimulate research in this area.

Graph convolutional networks (GCNs) have shown remarkable learning capabilities when processing graph-structured data found inherently in many application areas. GCNs distribute the outputs of neural networks embedded in each vertex over multiple iterations to take advantage of the relations captured by the underlying graphs. Consequently, they incur a significant amount of computation and irregular communication overheads, which call for GCN-specific hardware accelerators. To this end, this paper presents a communication-aware in-memory computing architecture (COIN) for GCN hardware acceleration. Besides accelerating the computation using custom compute elements (CE) and in-memory computing, COIN aims at minimizing the intra- and inter-CE communication in GCN operations to optimize the performance and energy efficiency. Experimental evaluations with widely used datasets show up to $105\times $ improvement in energy consumption compared to state-of-the-art GCN accelerator.

Domain-specific systems-on-chip (DSSoCs) combine general-purpose processors and specialized hardware accelerators to improve performance and energy efficiency for a specific domain. The optimal allocation of tasks to processing elements (PEs) with minimal runtime overheads is crucial to achieving this potential. However, this problem remains challenging as prior approaches suffer from non-optimal scheduling decisions or significant runtime overheads. Moreover, existing techniques focus on a single optimization objective, such as maximizing performance. This work proposes DTRL, a decision-tree-based multi-objective reinforcement learning technique for runtime task scheduling in DSSoCs. DTRL trains a single global differentiable decision tree (DDT) policy that covers the entire objective space quantified by a preference vector. Our extensive experimental evaluations using our novel reinforcement learning environment demonstrate that DTRL captures the trade-off between execution time and power consumption, thereby generating a Pareto set of solutions using a single policy. Furthermore, comparison with state-of-the-art heuristic–, optimization–, and machine learning-based schedulers shows that DTRL achieves up to 9× higher performance and up to 3.08× reduction in energy consumption. The trained DDT policy achieves 120 ns inference latency on Xilinx Zynq ZCU102 FPGA at 1.2 GHz, resulting in negligible runtime overheads. Evaluation on the same hardware shows that DTRL achieves up to 16% higher performance than a state-of-the-art heuristic scheduler.

Domain-specific systems-on-chip (DSSoCs) aim at bridging the gap between application-specific integrated circuits (ASICs) and general-purpose processors. Traditional operating system (OS) schedulers can undermine the potential of DSSoCs since their execution times can be orders of magnitude larger than the execution time of the task itself. To address this problem, we propose a dynamic adaptive scheduling (DAS) framework that combines the benefits of a fast (low-overhead) scheduler and a slow (sophisticated, high-performance but high-overhead) scheduler. Experiments with five real-world streaming applications show that DAS consistently outperforms both the fast and slow schedulers. For 40 different workloads, DAS achieves $1.29\times $ speedup and 45% lower EDP than the sophisticated scheduler at low data rates and $1.28\times $ speedup and 37% lower EDP than the fast scheduler when the workload intensifies.

Monolithic designs face significant fabrication cost and data movement challenges, especially when executing complex and diverse AI models. Advanced 2.5D/3D packaging promises high bandwidth and connection density to overcome these challenges, yet it also introduces new electro-thermal constraints. This paper develops a suite of analytical performance models to enable efficient benchmarking of a 2.5D/3D heterogeneous system for energy-efficient AI computing. These models encompass various performance metrics related to computing units, network-on-chip, and network-on-package. The results are summarized into a new tool, HISIM, which is 104–106× faster than state-of-the-art AI benchmark tools. Furthermore, HISIM integrates rapid thermal simulation for the 2.5D/3D system, helping shed light on both the potential and limitations of 2.5D/3D heterogeneous integration on representative AI algorithms. The code of HISIM is available at https://github.com/mec-UMN/HISIM.