In this study, the effect of Ti content on the electrochemical behavior and passive film growth mechanism of Ni₅₀Nb_50−xTi_x (x = 10, 15, and 20 at.%) metallic glasses produced via melt spinning was investigated. Structural characterization via X-ray diffraction (XRD) and transmission electron microscopy (TEM) confirmed the fully glassy nature and chemical homogeneity of all alloys. Electrochemical performance was evaluated in a 3.5 wt.% NaCl solution using potentiodynamic and potentiostatic polarization, as well as electrochemical impedance spectroscopy (EIS). The results showed that increasing Ti content improves corrosion resistance by reducing corrosion and passive current densities and increasing charge-transfer resistance. The Ni₅₀Nb₃₀Ti₂₀ alloy exhibited the best electrochemical performance, associated with the formation of a more stable and protective passive film. The passive film growth mechanism was analyzed using the High-Field Model (HFM). A linear relationship between inverse capacitance and anodic potential confirmed that ionic transport through the oxide layer governs passive film growth. The calculated electric field strength decreased systematically with increasing Ti content, suggesting the formation of passive films with lower defect density and enhanced barrier properties. These results demonstrate that adding Ti significantly enhances the passivation behavior of Ni-Nb metallic glasses and promotes the formation of stable oxide films with improved corrosion resistance in chloride-containing environments.