Parallel seam welding (PSW) is the most commonly employed encapsulation technology to ensure hermetic sealing and to safeguard sensitive electronic components. However, the PSW process is complicated by the presence of multiphysical phenomena and nonlinear contact problems, making the analysis of the dynamics of the PSW process highly challenging. This paper proposes a multiphysics simulation model based on direct coupling, enabling the concurrent coupling of the electric field, temperature field, and structural field to facilitate the analysis of the thermal and electrical dynamics within the PSW process. First, this paper conducts an in-depth theoretical analysis of thermal and electrical contact interactions at all contact interfaces within the PSW process, taking into account material properties related to temperature. Second, the acquired data are integrated into a geometric model encompassing electrode wheels and ceramic packaging components, facilitating a strongly coupled multiphysics simulation. Finally, the experimental results show that the simulated weld area deviates by approximately 6.5% from the actual values, and the highest component temperature in the model exhibits an approximate 10.8% difference from the actual values, thus validating the accuracy of the model. This directly coupled multiphysics simulation model provides essentially a powerful tool for analyzing the dynamic processes in the PSW process.

The nozzle-matrix gas flow velocity has a great influence on the accuracy of the temperature field of a printed circuit board assembly (PCBA) during the hot air convection reflow soldering process. This paper proposes a new approach that integrates the theoretical calculation, numerical simulation and an experimental test to accurately determine the nozzle-matrix gas flow velocity. First, the temperature profile of the aluminum alloy thin plate in convection reflow ovens is measured using a Wiken tester. Second, the nozzle-matrix gas flow velocity is theoretically calculated with the Martin formula. The computational fluid dynamic (CFD)simulation is performed according to the Icepak code, where a single oven chamber model is established to represent the 10 zones of soldering ovens to reduce computational resources considering the supry of the soldering ovens. The simulated temperature profile of the aluminum alloy thin plate is obtained and the specific response surface model (RSM) is established to represent the deviation between the simulated temperature and the measured temperature. Finally, based on reverse problem analysis, non-linear programming by quadratic Lagrangian (NLPQL) is used to solve the mathematical optimization model with the objective of minimizing the temperature deviation to obtain the corrected nozzle-matrix gas flow velocity. To validate the accuracy, the temperature test and the modeling using the corrected gas flow velocity for a new PCBA component for the soldering ovens is conducted separately. The temperature comparison between the simulation and the test shows that the maximum temperature deviation is within 10 °C. This provides evidence that the nozzle-matrix gas flow velocity obtained by the new approach is accurate and effective.