As the integration technology for integrated circuit (IC) packaging continues to advance, the issue of electromagnetic interference in IC packaging becomes increasingly prominent. Magnetic materials, acknowledged for their superior electromagnetic absorption capabilities, play a pivotal role in mitigating electromagnetic interference problems. In this study, we employed a liquid-phase reduction method. We prepared three types of cobalt (Co) particles with distinct morphologies. Through variations in the synthesis process conditions, we were able to control the aspect ratio of protrusions on the surface of the Co particles. It was found that the sword-like Co particles exhibit superior electromagnetic wave absorption capabilities, showing a reflection loss value of up to −50.96 dB. Notably, when the coating thickness is only 1.6 mm, the effective absorption bandwidth is extended up to 7.6 GHz. The spatially expansive sword-like Co particles, with their unique structure featuring dipole polarization and interfacial polarization, demonstrated enhanced dielectric and magnetic loss capabilities, concurrently showcasing superior impedance-matching performance.

In soft electronics, anisotropic conductive adhesive films (ACFs) are the trending interconnecting approach due to their substantial softness and superior bondability to flexible substrates. However, low bonding pressure (≤1 MPa) and fine-pitch interconnections of ACFs become challenging while being extended in advanced device developments such as wafer-level packaging and three-dimensional multi-layer integrated circuit board assembly. To overcome these difficulties, we studied two types of ACFs with distinct conductive filler sizes (ACF-1: ~20 μm and ACF-2: ~5 μm). We demonstrated a low-pressure thermo-compression bonding technique and investigated the size effect of conductive particles on ACF’s mechanical properties in a customized testing device, which consists of flexible printing circuits and Flex on Flex assemblies. A consistency of low interconnection resistance (<1 Ω) after mechanical stress (cycling bending test up to 600 cycles) verifies the assembly’s outstanding electrical reliability and mechanical stability and thus validates the great effectiveness of the ACF bonding technique. Additionally, in numerical studies using the finite element method, we developed a generic model to disclose the size effect of Au/Ni-coated polymer fillers in ACF on device reliability under mechanical stress. For the first time, we confirmed that ACFs with smaller filler particles are more prone to coating fracture, leading to deteriorated electrical interconnections, and are more likely to peel off from substrate electrode pads resulting in electrical faults. This study provides guides for ACF design and manufacturing and would facilitate the advancement of soft wearable electronic devices.