A novel design method based on a novel origami process that can create a solid structure swiftly and at a low cost is presented for rectangular waveguide-type microwave devices in this paper. A planar structure was fabricated by the lamination and laser cutting of polystyrene membranes and aluminum foils and was converted into a solid structure via origami in accordance with the selective absorption of infrared light. A rectangular waveguide, a rectangular waveguide-type coupler, and a power divider based on an origami structure with a multi-layer structure and a single-layer structure were fabricated and tested, demonstrating easy assembly and good microwave performance. The measured results of the rectangular waveguide indicated that the insertion loss was superior to −0.9 dB. Meanwhile, the results of the coupler showed that the coupling degree increased from −12.8 dB to −8.9 dB in the range of 11.0 GHz to 12.0 GHz. Correspondingly, the prepared power divider demonstrated that the return loss dwindled from −8.9 dB to −11.3 dB and that the insertion loss of one output port was approximate to that of the remaining one, varying between −3.5 dB and −5.2 dB in the range of 10.5 GHz to 11.5 GHz—verifying the effectiveness of the origami-based design method.

In this work, 1.5-level interconnections of RF microsystems with good RF performance, integration process compatibility, and high reliability are developed to meet the future demand for wireless communication microsystems in the millimeter wave band. Numerical models of 1.5-level interconnections based on solder balls with different diameters are established and analyzed using HFSS. The optimized structure parameters of 0.2 mm diameter Sn96.5Ag3Cu0.5 (SAC305) solder balls and 0.3 mm diameter Sn63Pb37 solder balls are selected for the interconnection between glass micro substrates and silicon micro substrates and between silicon micro substrates and HTCC substrates, respectively. Integration process parameters of the vertical interconnection are optimized. The micro substrate interconnection samples manufactured based on optimized integration methods and parameters show high reliability.