A cross-wavelength invisibility concept is proposed, inspired by a natural predator-prey relationship.

We propose a novel design of a 3D chiral metasurface behaving as a spatial polarization converter with asymmetric transmission. The metasurface is made of a lattice of metallic one-and-a-half-pitch helical particles. The proposed metasurface exhibits a dual-band asymmetric transmission accompanied by the effect of complete polarization conversion. Regarding circularly polarized waves, the metasurface demonstrates a strong circular dichroism. A prototype of the metasurface is manufactured for the quasi-optic experiment by using a 3D printing technique utilizing a cobalt–chromium alloy, which exhibits good performances against thermal fatigue and corrosion at high temperatures.

Photonic topological states, providing light-manipulation approaches in robust manners, have attracted intense attention. Connecting photonic topological states with far-field degrees of freedom (d.o.f.) has given rise to fruitful phenomena. Recently emerged higher-order topological insulators (HOTIs), hosting boundary states two or more dimensions lower than those of bulk, offer new paradigms to localize or transport light topologically in extended dimensionalities. However, photonic HOTIs have not been related to d.o.f. of radiation fields yet. Here, we report the observation of polarization-orthogonal second-order topological corner states at different frequencies on a designer-plasmonic kagome metasurface in the far field. Such phenomenon stands on two mechanisms, i.e., projecting the far-field polarizations to the intrinsic parity d.o.f. of lattice modes and the parity splitting of the plasmonic corner states in spectra. We theoretically and numerically show that the parity splitting originates from the underlying interorbital coupling. Both near-field and far-field experiments verify the polarization-orthogonal nondegenerate second-order topological corner states. These results promise applications in robust optical single photon emitters and multiplexed photonic devices.

Light carries spin angular momentum, which, in the free space, is aligned to the direction of propagation and leads to intriguing spin Hall phenomena at an interface. Recently, it was shown that a transverse-spin (T-spin) state could exist for surface waves at an interface or for bulk waves inside a judiciously engineered metamaterial, with the spin oriented perpendicular to the propagation direction. Here, we demonstrate the spin Hall effect for transversely spinning light—a T-spin–induced beam shift at the interface of a metamaterial. It is found that the beam shift takes place in the plane of incidence, in contrast to the well-known Imbert-Fedorov shifts. The observed T-spin–induced beam shift is of geometrodynamical nature, which can be rendered positive or negative controlled by the orientation of T-spin of the photons. The unconventional spin Hall effect of light found here provides a previously unexplored mechanism for manipulating light-matter interactions at interfaces.

Flexible multiplexing chips that permit reconfigurable multidimensional channel utilization are indispensable for revolutionary 6G terahertz communications, but the insufficient manipulation capability of terahertz waves prevents their practical implementation. Herein, we propose the first experimental demonstration of a flexible multiplexing chip for terahertz communication by revealing the unique mechanism of topological phase (TP) transition and perseveration in a heterogeneously coupled bilayer valley Hall topological photonic system. The synthetic and individual TPs operated in the coupled and decoupled states enable controllable on-chip modular TP transitions and subchannel switching. Two time-frequency interleaved subchannels support 10- and 12-Gbit/s QAM-16 high-speed data streams along corresponding paths over carriers of 120 and 130 GHz with 2.5- and 3-GHz bandwidths, respectively. This work unlocks interlayer heterogeneous TPs for inspiring ingenious on-chip terahertz-wave regulation, allowing functionality-reconfigurable, compactly integrated and CMOS-compatible chips.