This paper presents an automatic optimization system for the heat source layout of multi-chip modules, referred to as IOS. The system aims to optimize the heat source layout of multi-chip modules through the integration of multiple software tools. The IOS utilizes an optimization algorithm, WINDOW DOS, and other methods to achieve this goal. Initially, two optimization strategies are introduced which are utilized in conjunction with the Non-dominated Sorting Genetic Algorithm-II(NSGA-II). Subsequently, a simplified thermal model of the multi-chip module is applied to the IOS. The automatic optimization module is then used to optimize the heat source layout. In the end, we simulated and analyzed the application results. The simulation analysis reveals that when the temperature extreme value index is optimized, the PCB board’s transient temperature range falls within [343.14 K, 344.09 K]. Similarly, when the temperature homogeneity index is optimized, the PCB board’s transient temperature range falls within [343.39 K, 344.21 K]. Comparing these results with the experience layout, the temperature difference is reduced by 76.36% and 79.60%, respectively. The optimization results demonstrate that the IOS has a significant impact, offering remarkable optimization effects, low cost, high efficiency, and a more uniform temperature distribution. These findings indicate that the IOS holds promising potential for applications and provides value in optimizing the heat source layout of multi-chip modules.

In order to reduce the influence of temperature deformation of large-size body-mounted radiators on the observation accuracy of space station telescopes and adapt to launch vibration loads, this paper proposes a floating combination stress release mechanism. Firstly, based on the dimensions, operating conditions, and stress directions of the radiator, an “orthogonal + parallel” layout of the radiator stress release mechanism is designed. To verify whether the layout design complies with the fully constrained theory, the layout design model is simplified into a four-point model, including one fixed support, two line-degree-of-freedom release mechanisms, and one plane-degree-of-freedom release mechanism. Degree-of-freedom analysis is conducted, and the statically determinate support goal is successfully achieved. Then, through the layout design of the stress release mechanism, specific modeling designs are carried out for the fixed support, line-degree-of-freedom release mechanisms, and plane-degree-of-freedom release mechanism using three-dimensional modeling software. Finally, the feasibility of the design scheme is verified through finite element simulation and mechanical testing. The results show that under sine and random vibrations, the maximum response amplification factor is 4.2, which meets the design requirement of being less than five. The maximum stress is 192 MPa, which is lower than the material’s yield limit. Under the application of an 80 °C temperature difference, the displacement response value of the radiator is 3.28 mm. This value falls within the allowable movement range of the stress release mechanism and meets the design criteria.