Fashun Yang received a B.S. degree in semiconductors in 2000 and a Ph.D. degree in microelectronics and solid-state electronics in 2011, both from the Department of Electronics, Guizhou University, Guiyang, China.
From 2000 to 2005, he was an engineer at Yongguang Electronic Co., Ltd, Zhenhua Group, China. He joined Guizhou University, working as an Assistant Professor from 2011 to 2012, and has been an Associate Professor since 2013. He was a post-doctoral researcher at the University of Electronic Science and Technology from 2014 to 2018. His research interests include power integration technologies, 3D integration technologies, and thermal management of power systems.
Fashun Yang received a B.S. degree in semiconductors in 2000 and a Ph.D. degree in microelectronics and solid-state electronics in 2011, both from the Department of Electronics, Guizhou University, Guiyang, China.
From 2000 to 2005, he was an engineer at Yongguang Electronic Co., Ltd, Zhenhua Group, China. He joined Guizhou University, working as an Assistant Professor from 2011 to 2012, and has been an Associate Professor since 2013. He was a post-doctoral researcher at the University of Electronic Science and Technology from 2014 to 2018. His research interests include power integration technologies, 3D integration technologies, and thermal management of power systems.